STMicroelectronics introduces thin-mount Schottky diodes for improved power density and energy efficiency

     STMicroelectronics introduces 26 new Schottky diodes in thin SMA and SMB flat packages, rated voltage 25-200V, rated current 1-5A. The new diode is 1.0mm thick, which is 50% thinner than standard SMA and SMB packages, allowing designers to save space while increasing power density. The package area is the same as standard SMA and SMB, and can be directly inserted to replace the original device.

     The new diode is 1.0mm thick, which is 50% thinner than standard SMA and SMB packages, allowing designers to save space while increasing power density. The package area is the same as standard SMA and SMB, and can be directly inserted to replace the original device. In addition, ST's new Schottky diodes have a higher current rating than standard solutions with the same package area, and existing circuits using SMC diodes can be considered for smaller ST SMB flat package devices, and SMB designs can be converted to ST SMA flat package diodes.

     These new devices are built with state-of-the-art manufacturing technology and low forward voltage as an intrinsic feature, enabling superior energy efficiency for industrial and consumer applications such as power and auxiliary power supplies, chargers, digital signage, game consoles, set-top boxes, e-bikes, computer peripherals, servers, telecommunication boards and 5G Repeaters.

     STMicroelectronics 10-year product supply commitment to ensure the long-term supply of new Schottky diodes, SMA flat package is divided into 30V/1A STPS130AFN and STPS1L30AFN two products, SMB flat package includes STPS4S200UFN for 200V/4A and STPS5H100UFN for 100V/5A. All devices are specified with avalanche characteristics and have a slotted lead suitable for wave soldering and reflow soldering.