Samsung has announced the start of mass production of its lowest power consumption on-board UFS 3.1 memory solution

     Samsung Electronics announced that it has begun mass production of a new in-vehicle UFS 3.1 memory solution optimized for in-vehicle infotainment systems (IVI). The solution has the lowest power consumption of Samsung's in-car memory, enabling automakers to create excellent mobility experiences for consumers.

     To meet the different needs of customers, Samsung's UFS 3.1 (Universal Flash memory) will be available in 128, 256 and 512 gigabyte (GB) capacities. In future automotive (electric or autonomous vehicle) applications, the enhanced product lineup enables more efficient management of battery life. Among them, the 256GB capacity of the product, power consumption is reduced by about 33% compared to the previous generation, and also provides a sequential write speed of 700 megabytes per second (MB/s) and a sequential read speed of 2,000 MB/s.

     "Samsung's new UFS 3.1 solution is a timely response to different customer needs for optimized IVI systems, while meeting the next generation of memory trends that require higher environmental, social and corporate governance (ESG) standards." Hyunduk Cho, Vice President of Samsung Memory Product Planning Team, said, "With the introduction of the UFS 3.1 solution for Advanced Driver assistance systems (ADAS), we aim to expand our presence in the automotive semiconductor market. "

     The new Automotive UFS 3.1 solution complies with the Automotive Electronics Association (AEC-Q100) Level 2 (Automotive semiconductor quality standard) for stable performance over a wide temperature range from minus 40°C to 105°C.

     As Samsung Electronics continues to strengthen its portfolio of automotive memory solutions, Samsung received ASPICE Level 2 certification from the customer company on April 23, 2023 for its UFS 3.1 product for ADAS. This month, Samsung received the ASPICE Level 2 certification from C&BIS, a renowned automotive certification body, for this product, further proving the high stability required for the product to enter the automotive semiconductor market.