Silicon Labs' new mesh networking module simplifies secure IoT product design

     The introduction of a new family of highly integrated, secure Wireless Gecko modules reduces development costs and complexity to make it easier to add robust mesh networking connectivity to a wide range of Internet of Things (IoT) products. The new MGM210x and BGM210x Series 2 modules support leading mesh networking protocols (Zigbee®, Thread, and Bluetooth mesh), Bluetooth Low Energy, and multi-protocol connectivity. From smart LED lighting to home and industrial automation, they are able to provide one-stop wireless solutions to improve mesh network performance in wired powered iot systems.

     For iot product developers, time to market is a major challenge and a potential competitive advantage. Silicon Labs' pre-certified xGM210x modules help reduce the R&D cycle associated with RF design and protocol optimization, allowing developers to focus on their end applications. These modules are pre-certified in North America, Europe, Korea and Japan, minimizing the time, cost and risk factors associated with global wireless certification. The xGM210x module shortens time to market by several months.

     Based on Silicon Labs' Wireless Gecko Series 2 platform, the new module features industry-leading RF performance, a powerful Arm® Cortex®-M33 processor, an industry-leading software protocol stack, a dedicated security core, and operating temperatures up to +125°C. Suitable for harsh environmental conditions. The xGM210x module is designed to optimize the performance of resource-constrained iot products without sacrificing functionality to communication reliability, product safety, or field scalability. The integrated RF power amplifier makes these modules ideal for remote low-power Bluetooth applications that require hundreds of meters of line-of-sight connections.

     Matt Saunders, vice president of iot product marketing and applications at Silicon Labs, said: "This new portfolio of application-specific optimized modules provides a fast and easy wireless entry point for mesh networks, helping iot developers bring their connectivity products to market before competitors, while effectively safeguarding investment in tools and software." Our fully integrated modular design, comprehensive wireless protocol stack, state-of-the-art security and powerful development tools help our customers add wireless connectivity and mesh networking capabilities to iot applications with minimal R&D investment, saving months of engineering effort and testing."

     The initial range of the Series 2 module portfolio includes the industry's first pre-certified wireless module optimized for LED bulbs and a general purpose printed circuit board (PCB) form factor module designed to meet the needs of a wide range of ultra-small iot products.

     The xGM210L module is designed to meet the unique performance, environmental, reliability and cost requirements of smart LED lighting. These modules combine a custom form factor for easy installation of LED bulb housing, PCB antenna to maximize wireless range, high temperature rating, extensive global regulatory certification, and low operating power consumption to bring the perfect wireless solution for cost-sensitive, mass-produced smart LED bulbs.

     The xGM210P module has a PCB form factor, integrated chip antenna and minimal structural void area to simplify space-constrained iot designs, including smart lighting, HVAC, building and factory automation systems.