According to the US Environmental Protection Agency, e-waste is the fastest growing source of waste in the world, growing to 53.6 million tons in 2019, a 21 percent increase since 2014. Semtech's HotSwitch platform helps protect electrical systems by providing advanced protection features that extend the life of electronic devices and reduce e-waste.
Semtech Corporation's HotSwitch Protected IC. The HotSwitch platform includes integrated load switches and electric fuses with an outstanding set of advanced protection features to protect electronic systems from transient and steady-state fault conditions typical of circuits.HotSwitch devices are specifically designed to detect power surges and provide robust security for downstream subsystems by cleverly disconnecting the load from the power supply. They provide more robust shielding against failures such as surge current, overvoltage, undervoltage, reverse current, short circuit, and overheating.
The HS2950P HotSwitch is a single channel integrated high voltage side load switch with input voltage range from 2.7V to 29V and can support output current up to 5A. The HS2950P comes in 3 mm x 3 mm 12-pin DFN package. The device provides thermal turn-off capabilities and fault markers to ensure robust defense for downstream industrial, telecommunications and consumer systems affected by transient and short circuits.
The HS2240P HotSwitch is an integrated electric fuse and surge protection device designed to protect against a variety of electrical overload (EOS) conditions, including lightning, electrostatic discharge (ESD) and short circuits. The device operates in the input voltage range of 2.7V to 22V with a current limiting threshold of 3.9A. The HS2240P comes in a 14-pin DFN package of 3.5mm x 2mm.
These two HotSwitch devices provide strong protection for consumer products, industrial equipment, appliances, smart TVS and more. With low leakage and low static current characteristics, these devices can also extend the battery life of portable devices. HotSwitch IC also reduces material count and space footprint compared to discrete or multi-chip solutions.
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