Smiths Interconnect Announces Expansion of DaVinci Test Stand Product Line

     Smiths Interconnect announced the expansion of its DaVinci high-speed test series product line and the launch of the DaVinci micro test stand, which is specially designed for high-speed testing with a minimum spacing of 0.35 mm.

     Various connectivity devices and data intensive applications continue to drive the growth of demand for high-performance and adaptable computing solutions. Mobile devices such as mobile phones, tablets and automotive infotainment systems have the most complex chip level systems (SoC) ever. These chip level systems face the challenge of combining multiple processing components such as CPU, GPU, AI engine, camera processor, memory and 5G modem into one chip to save space, cost and power consumption.

 
     The requirement of adding more functions on the chip size as small as possible has reduced the spacing of integrated circuits to less than 500 microns. At the same time, if the key components of the system are integrated on a chip, the improvement of the chip performance will cause pin to pin noise, or called "crosstalk" in the test.

     Although test engineers have made great efforts in packaging design, the reduction of chip size will inevitably cause high-speed signals to be vulnerable to crosstalk, leading to false test failures.

     Smiths Interconnect aims to break through this testing bottleneck by using DaVinci technology. DaVinci Micro test socket makes full use of DaVinci coaxial technology applied by integrated circuit (IC) to achieve 350 µ m spacing and provide ideal pin to pin isolation, reduce the impact of crosstalk during the test process, and greatly improve the accuracy of chip performance test. Its innovative design protects the small diameter signal probe, ensuring that the product can be deployed and withstand the test of harsh test environment.

     "The launch of the DaVinci Micro high-speed test stand can significantly enhance the innovation of Smith Interconnect's customers in high-performance computing, graphics and adaptive SoCs technology." Brian Mitchell, General Manager and Vice President of Semiconductor Test Business Department of Smiths Interconnection, said. "The fully shielded signal path of DaVinci Micro effectively eliminates the crosstalk problem in the test process and significantly improves the test performance, which makes it different from other non DaVinci series products.