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TDK InvenSense's ICS-40638 high-performance microphone delivers 138 dB SPL AOP

Dec 29 2022 2022-12 Sensors TDK
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TDK InvenSense ics - 40638 MEMS microphone simulation provides a 138 dB sound pressure level (SPL) of ultra-high acoustic overload (AOP), which is particularly efficient 170 μ Low power operation, high signal-to-noise ratio (SNR) 63 dB small x 2.65 mm 0.98 mm 3.5 mm bottom port surface mount package. The analog MEMS microphone has a high dynamic range and a working temperature of 105 ° C, which is specially designed for the Internet of Things and consumer devices.

     TDK InvenSense ics-40638 MEMS microphone simulation provides an ultra-loud overload (AOP) sound pressure level (SPL) of 138 dB, exceptionally efficient 170 μ-low-power operation, and high signal-to-noise ratio (SNR) of 63 dB smaller x 2.65mm 0.98mm 3.5mm bottom port surface mounting pack. Analog MEMS microphones with high dynamic range and operating temperatures up to 105°C are designed for Internet of Things and consumer devices.

 

     The ICS-40638 microphone is ideal for wearable and Internet of Things applications, especially outdoor, industrial or harsh environments where high temperatures and high sound overload points pose challenges for system design. The icp-40638 includes a MEMS microphone element, an impedance converter, and a differential output amplifier. Other high performance specifications include tight ±1 dB sensitivity tolerance and enhanced immunity to radiated and conducted RF interference. The unit is ideal for noise cancellation applications in challenging environments.

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