TDK TFM-BLE thin-film power circuit inductor: small and thin to achieve high current and low loss

     TDK has developed a new TFM-BLE series of thin-film power circuit inductors. TDK has incorporated thin-film technology developed in the head business into the manufacturing of this series of inductors. Using TDK's characteristic conductor formation technology, magnetic metal materials with high saturation flux density are used as the core material to meet the DC bias characteristics required by inductors in power circuits and optimized for space-constrained applications such as smartphone power circuits. The introduction of thin film inductors is helpful to increase the inductance and reduce the device size, which opens up an effective way for the miniaturization of inductors and the realization of efficient power supply circuit.

     The panel area and terminal structure of the TFM-BLE are consistent with that of the universal patch element, secure installation, and can be installed into a universal pad layout. The series currently offers three inductors ranging from 0.24µH to 0.47µH, tolerance ±20%, operating temperatures −40°C to +125°C, and dimensions of 2.0mm × 1.20mm × 0.8mm for compact applications.

     In terms of appearance, the TDK's new inductor series is significantly better than its predecessor TFM201208BLD (2.0mm × 1.25mm × 0.8mm) in terms of current and resistance levels. The rated current of TFM-BLE is increased by 10% to 5.5A and the DC resistance is reduced by 22% to 25 Mω compared to the conventional product (0.33µH). These parameters are among the best in the industry for an inductor of this size.