TDK introduces CeraLink capacitors with modular flexible assembly technology

     TDK Corporation introduces the CeraLink FA type capacitors with modular flexible assembly technology, further expanding the product lineup of mature CeraLink capacitors. The new type of capacitor uses a space-saving design, and two, three or even ten identical capacitors are connected in parallel on the same terminals to increase the capacity.

     TDK Corporation introduces the CeraLink FA type capacitors with modular flexible assembly technology, further expanding the product lineup of mature CeraLink capacitors. The new type of capacitor uses a space-saving design, and two, three or even ten identical capacitors are connected in parallel on the same terminals to increase the capacity.

     CeraLink FA type capacitors are available with voltage ratings of 500V DC, 700V DC and 900V DC, with capacitance values between 0.5μF and 10μF, depending on the rated voltage and number of capacitors. A unique feature of these PLZT (lead lanthanum zirconate titanate) based ceramic capacitors is that they achieve a tolerable operating temperature of up to 150 °C. Type FA capacitors are 7.4 mm wide and 9.1mm high, and are available in three sizes of 6.3mm, 9.3mm or 30.3mm in length. Despite their small size, they are capable of absorbing up to 47 ARMS of ripple current.

     A major advantage of the parallel switch is its ultra-low ESR (equivalent series resistance), which is significantly lower than 10 mΩ in the large frequency range of 0.1 to 1MHz. The ESL (equivalent Series inductance) is extremely low even at a minimum of 3nH inductance. With weak parasitic effects, CeraLink capacitors are well suited for converter topologies based on fast-switching semiconductors such as GaN or SiC, with significantly lower overcharge voltages at conversion than conventional capacitor technologies. In addition, CeraLink capacitors can easily meet special requirements in terms of size, current capacity, and temperature.