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TDK introduces a new MEMS-based ToF sensor with expanded sensing range

Jun 30 2020 2020-06 Sensors TDK
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TDK announced that it now has the option to select original equipment manufacturers (Oems) for its Chirp CH-201 MEMs-based ultrasonic time-of-flight (ToF) sensor with expanded sensing range. The ToF sensor uses a tiny ultrasonic transducer chip to emit ultrasonic pulses and then listens for the echoes returned from a target located in the sensor's field of view.

     TDK announced that it now has the option to select original equipment manufacturers (Oems) for its Chirp CH-201 MEMs-based ultrasonic time-of-flight (ToF) sensor with expanded sensing range. The ToF sensor uses a tiny ultrasonic transducer chip to emit ultrasonic pulses and then listens for the echoes returned from a target located in the sensor's field of view. By calculating distance based on ultrasonic time of flight (ToF), the sensor can determine the position of an object relative to the device and trigger programmed behavior.

 

     TDK's MEMS ultrasonic technology utilizes a self-developed ToF sensor in a 3.5mm x 3.5mm package and combines a MEMS ultrasonic transducer and an energy-efficient digital signal processor (DSP) on a custom low-power mixed-signal CMOS ASIC. The sensor can be equipped with multiple ultrasonic signal processing capabilities, providing customers with industrial design solutions for a wide range of use case scenarios, including ranging, presence/proximity sensing, object detection/obstacle avoidance, and 3D position tracking.

 

     CH-101 is the first commercially available MEMS-based ultrasonic ToF sensor for consumer electronics, AR/VR, robotics, drones, Internet of Things (IoT), automotive and industrial markets. Following the launch of the CH-101 last year, TDK is expanding the SmartSonic MEMS ultrasonic platform to include the CH-201 Ultrasonic ToF sensor for indoor sensing applications and associated software solutions that enable ultra-low power, uninterrupted sensing in many other use cases. In order to detect the presence of people without privacy concerns.

 

     "The CH-201 sensor is a continuation of our innovative work in piezoelectric MEMS technology and low-power ASIC design and development, enabling high-performance, low-power ultrasonic sensing in miniature packages," Michelle Kiang, CEO of Chirp Microsystems, a Japanese TDK group company. "As the sensing range of the CH-201 sensor expands, product designers can implement new capabilities with the latest ultrasonic ToF sensors to enhance the user experience of multiple consumer products. Both CH-101 and CH-201 sensors have been adopted by leading consumer brands in robotic vacuum cleaners, smart speakers, personal computers, and more. TDK's CH-101 has been incorporated into our SonicTrack™ 6DoF controller tracking solution for HTC's Vive Focus Plus VR motion system, and we look forward to introducing several new MEMS ultrasonic product launches based on TDK Japan in the coming year."

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