TDK introduces a new ultra-thin µ POL DC to DC converter

     TDK Corporation announced the introduction of FS1412 microPOL (µ POL) power module. The size of FS1412 is 5.8 ㎜ x 4.9 ㎜ x 1.6 ㎜, which is part of the new series of µ POL DC to DC converters. It has higher performance, the smallest available size, ease of use and simplified integration, and is suitable for applications such as big data, machine learning, artificial intelligence (AI), 5G cellular, Internet of Things, telecommunications and computer enterprises. μ POL technology includes a DC to DC converter placed near complex chipsets such as ASIC and FPGA. Minimize resistance and inductance components by reducing the distance between the converter and the chipset, allowing fast response and precise adjustment under dynamic load current

     TDK has been developing this technology for many years to enable system level solutions to improve electrical and thermal performance, and to provide high-density, cost-effective solutions for space constrained applications that require thinner power supplies. These new solutions integrate high-performance semiconductors into advanced packaging technologies, such as semiconductor embedded substrate (SESUB) and advanced electronic components, to achieve unique system integration through 3D integration in a smaller size and thinner shape. This integration allows TDK to provide greater efficiency and ease of use at today's lower total system cost.

     The new µ POL DC to DC converter series can operate in a wide junction temperature range of - 40 ℃~125 ℃, and has a high current density of more than 1000 A per cubic inch. This series provides 12 A current, the minimum height available in the market is 1.6 ㎜, and provides 50% less solution size than other similar products. Therefore, this also minimizes the cost of the system solution, reduces the size and assembly cost of the circuit board, as well as the BOM cost and PCB cost.