TDK introduces ultrasonic time-of-flight sensors with extended sensing range

TDK's MEMS ultrasonic technology utilizes a self-developed ToF sensor in a 3.5mm x 3.5mm package and combines a MEMS ultrasonic transducer and an energy-efficient digital signal processor (DSP) on a custom low-power mixed-signal CMOS ASIC. The sensor can be equipped with multiple ultrasonic signal processing capabilities, providing customers with industrial design solutions for a wide range of use case scenarios, including ranging, presence/proximity sensing, object detection/obstacle avoidance, and 3D position tracking.

CH-101 is the first commercially available MEMS-based ultrasonic ToF sensor for consumer electronics, AR/VR, robotics, drones, Internet of Things (IoT), automotive and industrial markets. Following the launch of the CH-101 last year, TDK is expanding the SmartSonic™ MEMS ultrasonic platform to include the CH-201 Ultrasonic ToF sensor for indoor sensing applications and associated software solutions that enable ultra-low power, uninterrupted sensing in many other use cases. In order to detect the presence of people without privacy concerns.

TDK's MEMS Ultrasonic ToF sensor solution offers a number of advantages over optical ToF sensors:

● Ultra-low power operation for uninterrupted induction in battery-powered devices

● Accurate measurement range regardless of the size or color of the target object; It can even accurately detect light penetration of target objects

● Not affected by environmental noise, will not be detected by indoor pets

● Unlike infrared sensors that cannot work in direct sunlight, they can work in all lighting conditions

● It is significantly different from laser-based IR ToF sensors to ensure eye safety

● The maximum 180° field of view can be customized to detect objects, so that a single sensor can support the entire room scene sensing

"The CH-201 sensor is a continuation of our innovative work in piezoelectric MEMS technology and low-power ASIC design and development, enabling high-performance, low-power ultrasonic sensing in miniature packages," Michelle Kiang, CEO of Chirp Microsystems, a Japanese TDK group company. "As the sensing range of the CH-201 sensor expands, product designers can implement new capabilities with the latest ultrasonic ToF sensors to enhance the user experience of multiple consumer products.

Both CH-101 and CH-201 sensors have been adopted by leading consumer brands in robotic vacuum cleaners, smart speakers, personal computers, and more. TDK's CH-101 has been incorporated into our SonicTrack™ 6DoF controller tracking solution for HTC's Vive Focus Plus VR motion system, and we look forward to introducing several new MEMS ultrasonic product launches based on TDK Japan in the coming year."