TE Connectivity introduces AMPMODU Interconnect system to meet industry needs

     TE Connectivity's AMPMODU interconnect system, a global leader in connectivity and sensing, is the signal standard for automation and control applications. The system is economical and reliable, including board-to-board, wire-to-board and wire-to-wire connector. With a variety of different components and application possibilities, the system combines the advantages of small size and excellent quality, making it an ideal interconnect system for a wide range of industrial applications and systems.

     The AMPMODU 50/50 Grid connector family includes a variety of high-density board-to-board and wireline-to-board connectors with pitches of 0.050 x 0.050 (1.27 mm x 1.27 mm). Three different height parallel stacks or in combination with a locked cable assembly create a reliable connection. The AMPMODU Mod IV V connector family includes a wide range of robust wireline-to-board connectors in a modular 0.100" x 0.100" (2.54 x 2.54mm) centerline construction.

     They are plugged into AMPMODU detached, covered, and uncovered connectors via 0.025" (0.64) square posts. The AMPMODU MTE with connecting bezels can group the female components into a two-row configuration. They are available in prick and crimp end types, while their latching function provides reliable retention between housings. The AMPMODU System 50 Connector series includes a variety of high-density board-to-board and wireline board connectors. Sockets with cables can be terminated using ribbon cable or FFC cable technology. AMPMODU connectors offer a variety of robust 0.100 "x 0.100" (2.54 x 2.54) centerline configurations using 0.025 "square columns.