TE Connectivity introduces a new high-density SFP-DD dual-channel I/O interconnect system

     TE Connectivity announced the introduction of a small format pluggable dual density (SFP-DD) input/output (I/O) interconnect system to expand its SFP portfolio. The new "dual-density" housing and surface-mount connector break through the traditional single-channel design of the SFP structure to provide dual-channel data transmission to meet the data center's dual-port density requirements and increase data transfer rates.

     Compared to the SFP28/SFP56 portfolio, the SFP-DD solution provides higher density channels, better signal integrity, and more PCB and panel space. The SFP-DD Connector dual-channel interface supports data rates up to 28 Gbps NRZ and 56 Gbps PAM-4, and can be expanded to 112G PAM-4 in the future, providing data transfer rates up to 56 Gbps or 112 Gbps.

     The new housing and connector are backward compatible with existing SFP products, making them easy to upgrade. SFP-DD connectors enable flexible system design and provide customized solutions for thermal management, cable length, and stack configuration. In addition, the SFP-DD interconnect solution provides superior thermal management performance through TE's innovative thermal bridge technology.

     Jimmy Ju, Product Manager of TE's Data and Terminal Devices Business group, said: "SFP-DD products provide a compact, efficient interconnect solution for high-speed I/O data transfer applications. "The solution addresses server challenges such as redundancy due to underutilized channels, increasing bandwidth, and leveraging its high-density channels to support networked devices for optimal performance."