TE Connectivity introduces high-density current Goldfinger power connectors

     TE Connectivity (TE), a global leader in connectivity and sensors, announced the introduction of a new high density (HD+) Goldfinger power connector. The connector is the highest current density Goldfinger power connector on the market, capable of supporting up to 3 kilowatts of power to meet the escalating power needs of next-generation data centers. TE's new HD+ Goldfinger connector supports current densities up to 15A/2.54mm and provides 2000-3000W power connection support for data center equipment. The connector has a signal pitch of 1.27mm and a power supply pitch of 5.08mm, and its operating voltage is 60V DC.

     In addition, with a unique double-layer power terminal and straight-through contact design, the new HD+ Goldfinger power connector enables multiple contact points when paired with the PCB, resulting in low contact resistance. The connector products meet industry PCB packaging standards and use common power and signal terminal modules to make them compact and cost-effective. HD+ Goldfinger connectors can support both low and high power applications under AC and DC, and designers can flexibly configure the number of terminals for better scalability. This connector is suitable for server, switch and mass storage system applications.

     Bandy Yuan, TE Connectivity Product Manager, said: "As the power requirements of data center equipment continue to increase, designers need a connector with high performance, high density and high reliability to meet the design needs. "TE's new HD+ Goldfinger power connector is not only the highest current density Goldfinger power connector on the market, its double-layer power terminal design ensures superior reliability."