TE Connectivity's Economical New Board-to-Board Connectors Upgrade COM Express Applications to 16 GT/s

     TE Connectivity (TE), a global leader in innovative connectivity solutions for high-speed computing and networking applications, has launched a new generation of free-height COM (Computer on Module) connectors with a centerline spacing of 0.5mm, designed to meet the usual requirements for high-speed data transmission and different stacking heights vertical, parallel board-to-board connection requirements. The new series of connectors conform to the COM Express Type 7 specification and are compatible with the PCIe Gen 4 protocol.

     Supports transfer speeds up to 16 gigabits per second (Gt/s), doubling the performance of most previous COM connectors. And whether it's a combination of new sockets with new plugs, or new sockets with old plugs, signal integrity is improved through low insertion loss, low return loss, and low PSNEXT and PSFEXT.

     Support system flexible design, configurable stack height (5mm, 8mm) and pin position (220, 440). Economical solution in the same package as other COM standards. Customers typically do not need to change the printed circuit board (PCB) footprint when upgrading applications. The improved mechanical design reduces insertion and extraction forces by approximately 30% compared to the previous generation, making operation easier for the user.

     "Speed and performance are critical today, and our new 0.5mm free-height COM connector connects CPUs to carrier boards in a variety of applications, including healthcare equipment," said Sam Chen, Product Manager, Data and Terminal Equipment Business Unit, TE Connectivity. , industrial machinery, test and measurement equipment, and telecommunications equipment. TE is proud to provide customers with flexible and cost-effective solutions to help them achieve the high-speed transmission required by today's marketplace."