TE Connectivity's new thermal bridge solution significantly optimizes thermal resistance

     TE Connectivity, the global leader in innovative connectivity solutions for high-speed computing and networking applications, announced the launch of thermal bridge technology that provides twice the heat transfer performance of traditional heat sink + thermal pad technology. As systems such as servers, switches and routers transmit data faster and design more complex, system power requirements increase, and the industry needs new thermal solutions to handle more heat. TE's thermal bridge solutions provide superior thermal resistance, are more reliable, durable and easier to maintain than similar products on the market.

     TE Thermal bridge solutions are optimized to significantly improve the thermal conductivity of traditional heat dissipation solutions such as coolant heat transfer, heat pipe heat transfer, multi-radiator heat transfer, and chassis direct heat transfer in airflow constrained input/output (I/O) applications. It features virtually no gaps between the internal cooling sheets, providing better and more sustained heat transfer performance while minimizing the need for compression.

     In addition, its elastic compression design prevents deformation or relaxation caused by long-term use, ensures long-lasting and stable thermal conductivity, and reduces component replacement during system maintenance. The TE thermal bridge is pre-installed on the I/O cage, and relies on reliable compression force to transfer heat from the I/O optical module to the cooling area through the cooling pad.

     Zach Galbraith, Product Manager for TE Connectivity's Data and Terminal Devices business group, said: "Engineers are developing next-generation computing and networking systems, and TE's cooling bridge technology simplifies system architecture, eliminating the need for additional mechanical compression devices in traditional solutions and reducing the number of components. As a leader in thermal management innovation, TE's new thermal bridge solution reaches new heights of performance and durability."