TE introduces new Sliver jumper connectors for OCP NIC 3.0 applications

     TE Connectivity, the global leader in innovative connectivity solutions for high-speed computing and networking applications, announced the introduction of a new Sliver jumper connector that features a new standard form factor and supports panel pluggability for the Open Source Computing Project (OCP) NIC 3.0. This new jumper connector further expands the Sliver product family and is suitable for compact OCP NIC 3.0 cards, allowing for easy system maintenance while improving thermal performance.

     The SFF-TA-1002 Sliver jumper connector supports PCIe Gen 5 high-speed data transfer and can be extended up to 112G. The SFF-TA-1002 standard is considered as an alternative to various specifications such as M.2, U.2 and PCIe. The Sliver jumper connector is designed with a high density of 0.6mm pitch and supports the number of channels required by the PCIe standard for next-generation silicon technology, while existing products on the market have reached their channel limit.

     OCP NIC 3.0 card uses the horizontal panel plug design, through the housing to increase the system air circulation, more effectively improve the design convenience of the system. TE's new Sliver jumper supports OCP NIC 3.0, making it one of the best-performing and most cost-effective solutions on the market.

     Ann Ou, TE Connectivity Product Manager, said, "OCP designs are taking the data center equipment industry by storm, and TE Connectivity is a major supplier of connector solutions for such designs. "Our Sliver jumper connectors offer superior performance and high density in a standardized form to facilitate the design and manufacturing of data center equipment partners."