TI's New Magnetic Packaging Tech Halves Power Module Size

Texas Instruments (TI) has introduced six new power modules designed to boost power density, efficiency, and reduce EMI. Leveraging TI’s proprietary MagPack™ packaging technology, these modules offer up to a 50% reduction in size compared to previous models while maintaining the same thermal performance and doubling power density. The industry’s ultra-compact 6A power modules now provide 8dB lower EMI radiation and up to 2% increased efficiency compared to previous generations.
The new devices include three ultra-compact 6A modules (TPSM82866A, TPSM82866C, and TPSM82816) capable of delivering 1A per square millimeter of current output. Jeff Morroni, Director of Power Management R&D at TI Kilby Labs, states, "Designers use power modules to save time, reduce complexity, and minimize component count, but previously had to compromise on performance. With nearly a decade of development, TI’s integrated magnetic packaging technology helps power designers meet the evolving industry trends, providing higher output power in smaller spaces."
The MagPack™ technology features TI’s unique 3D packaging process, minimizing the height, width, and depth of power modules while delivering greater output power in a more compact footprint. The integrated magnetic power inductors made from proprietary new materials facilitate high power density, low temperatures, low EMI radiation, and high conversion efficiency. Analysts predict a 100% increase in data center power demand by 2030, where these performance enhancements can play a crucial role in improving power usage efficiency.
For more information, read the technical article "MagPack Technology: Four Key Advantages of New Power Modules to Deliver Greater Power in Smaller Spaces." TI’s new MagPack™-based power modules are now available for pre-production through TI.com, with various payment options, currencies, and shipping methods supported.