TT Electronics introduces thermal jumper chips to enhance temperature rise management

     TT Electronics, a global supplier of engineered electronics for performance-critical applications, announced the launch of the TJC series of thermal jumper chips that enable circuit designers to manage the temperature rise of compact power electronic components. These components provide thermal conduction paths with electrical isolation for managing PCB hot spots. Aluminum nitride has a thermal conductivity nearly five times that of alumina and is used in thermal jumper chips to keep compact electronic components cool, thereby increasing product reliability.

     "There is a growing demand for compact, high-power components that require board-level thermal management," said Stephen Oxley, senior Resistor Engineer for Applications and Marketing at TT Electronics. "TT is the only global resistor manufacturer to offer this technology to address thermal instability in high power density designs."

     The TJC series has a greater thermal conductivity than 70 μcu equivalent area and therefore a better thermal connection than an uninterrupted trace.  The compact quality and design of the component, which can be provided in case sizes as small as 0603, minimizes PCB area and total assembly size and weight. These features are particularly suitable for power supply, power amplifier, RF amplifier, and high power laser diode applications in the aerospace, medical, and industrial markets.