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TTTech partners with STMicroelectronics to provide high performance outer space networking solutions

Jul 11 2023 2023-07 Semiconductors STMicroelectronics
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With the development of the global space industry, more and more projects require highly reliable "space-grade" chips and stable supply chains. TTTech, a technology leader in secure network computing platforms, and ST, a leading global semiconductor company serving multiple electronics applications, are celebrating seven years of collaboration in the space sector. TTTech's advanced, secure and reliable networking chips and platform solutions developed with ST chips have been deployed in major commercial and scientific exploration projects in the space industry

     With the development of the global space industry, more and more projects require highly reliable "space-grade" chips and stable supply chains. TTTech, a technology leader in secure network computing platforms, and ST, a leading global semiconductor company serving multiple electronics applications, are celebrating seven years of collaboration in the space sector. TTTech's advanced, secure and reliable networking chips and platform solutions developed with ST chips have been deployed in major commercial and scientific exploration projects in the space industry. After the first chip co-developed by TTTech and ST was selected for the Ariane 6 launch vehicle program, a second chip optimized for the harsh environment of outer space has been selected for the Gateway space Station, a key component of NASA's Artemis program.

 

     Georg Kopetz, CEO of TTTech, said: "We are witnessing the dawn of a new space age. The space market has received a large amount of commercial financing, and the government is increasing its investment in the market. There is a growing demand for global Internet access and Earth observation satellite constellations. At the same time, international partnerships such as NASA's Artemis manned space program, the Gateway Space Station, are advancing space travel and new industrial projects, such as lunar homes and manned vehicles. These investments also increase the demand for high-tech, secure and reliable digital communications solutions, which are our core competencies. TTTech is proud to be part of these initiatives and to partner with a leading technology company like ST to shape the future of the space market."

 

     Vincent Fraisse, General Manager RF and Communications at STMicroelectronics, said: "Cutting-edge technology is necessary to realize the vision of an Internet from outer space. By partnering with market leaders such as the Space Agency and TTTech, ST is helping the space industry. As part of this collaboration, we have developed two innovative products based on the same chip, one that provides high reliability for the short but difficult launch vehicle program, and the other is a long-life product that can fly for 15 years in the extremely harsh environment of outer space. As a vertically integrated semiconductor manufacturer (IDM), ST will bring decades of highly reliable semiconductor expertise to this market in transition, as well as customer security through the company's front-end and back-end manufacturing capabilities in Europe."

 

     In 2021, TTTech and ST completed the development, commercialization and customer test validation of the highly integrated radiation-hardened TTEthernet network controller chip. Today, these chips are used in avionics systems for multiple launch vehicles and robotics programs, including the Ariane 6 launch vehicle program and the NASA Gateway capsule.

 

     Specifically, TTTech and ST are participating in the development of the Ariane 6 avionics backbone system, where the challenge is to develop and test a short life cycle solution adapted to the harsh conditions of rocket launches. The Ariane 6 European Launch Vehicle system was commissioned by the European Space Agency to be developed by Ariane Group and is still in the testing phase. The chips and associated software developed by TTTech and ST are integrated into more than 50 avionics devices that are all connected to a redundant TTEthernet® network, the "nervous system" of the launch vehicle.

 

     The second chip will use a sealed ceramic package that can withstand the very harsh radiation conditions of outer space and extend the product life cycle to several years. The new product will be installed inside the Residential Supply Module (HALO) and the Power and Boost Unit (PPE), the first two NASA Gateway space Station capsules to go into space. The Gateway station will be the first space station in lunar orbit and is a key component of NASA's Artemis human spaceflight program, which aims to send the first woman and the next man to the moon in 2024, and eventually a future manned spacecraft to Mars.

 

     The PPE capsule, with a power generation capacity of 60kW, powers the Gateway Space Station subsystem and the solar Electric Boost system, enabling the station to operate and communicate along its unique orbit around the moon as an outpost in lunar orbit. At the same time, the HALO capsule will provide command, control and power distribution systems for the entire space station, as well as living quarters and research facilities, and communication functions between the station and the lunar surface expedition team.

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