Texas Instruments CSD96416 Synchronous step-Down NexFET™ Power class is a highly optimized design for high power, high density synchronous step-down converters. The product integrates drive IC and power mosfet to complete power level switching function. This combination produces high current, high efficiency and high speed switching capabilities in a 5mm x 6mm compact package.
This power level features adjustable dead zone trims to improve transient response of non-TI controllers. It also integrates precise current sensing and temperature sensing features to improve accuracy and simplify system design. In addition, the PCB footprint of TI CSD96416 has been optimized to help reduce design time and simplify completion of the overall system design.
Features
● 50A peak current rating
● 16V VIN, 25V high-side and low-side FET
● Adjusted deadtime trim to improve transient response with a non-TI controller
● Peak efficiency (fSW = 600kHz, LOUT = 150nH): over 94%
● High-frequency operation (up to 1.75MHz)
● Temperature-compensated bi-directional current sense
● Analog temperature output
● Fault monitoring
● 3.3V and 5V PWM signal compatible
● Tri-state PWM input
● Integrated bootstrap switch
● Optimized deadtime for shoot-through protection
● High density, QFN 5mm × 6mm footprint
● Ultra-low-inductance package
● System-optimized PCB footprint
● Thermally enhanced topside cooling
● RoHS-compliant, lead-free terminal plating
● Halogen-free
Applications
● Multiphase synchronous buck converters
● High-frequency applications
● High-current, low-duty cycle applications
● Point-of-load (POL) DC-DC converters
● Memory and graphic cards
● Desktop and server V-Core synchronous buck converters
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