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The new generation of non-silicone is optional without hot glue

Feb 13 2023 2023-02 Passive Components Parker Chomerics
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The Chomerics Division of Parker Hannifin Corporation has released THERM-A-GAP GEL 40NS, the next iteration in its silicone-free, thermally conductive gels. This one-component, low-outgassing material provides a special formulation to satisfy the stringent requirements of silicone-sensitive applications such as optical equipment, camera modules, high-performance sensors and data storage devices.

     Parker Hannifin Corporation's chemomerics division has released THERM-A-GAP GEL 40NS, the next iteration of its silicon-free thermal conductivity gel. This single-component, low-deflated material provides a special formulation to meet the rigorous requirements of silicon-sensitive applications such as optical devices, camera modules, high-performance sensors and data storage devices.

 

     The gel provides heat transfer performance with 4W/m-K thermal conductivity, and users will find thermal reliability materials in ultra-low compression packages: it is easy to deform under assembly pressure, minimizing stress on components, solder joints and leads. This fully cured and disposable product eliminates mixing, maintaining the traditional advantage of the company's thermal gel line for seamless integration into high-volume automated assembly applications, as well as rework and field repair situations.

 

     Thermal gels reliably conform to rough surface irregularities, displace air gaps, and occupy manufacturing tolerances for heat-producing parts. The product provides low thermal impedance in bonding wires as thin as 0.15mm(0.006 "). "The consumer electronics, automotive and telecommunications industries have spent years waiting for a high performance, reliable, non-silicone solution suitable for a combination of combustible and cost-effective thermal interface materials," said Ben Nudelman, global market manager, Chomerics Division. "We are very excited to introduce a product that finally meets these needs and has a combination of physical and thermal performance that is unmatched in the industry today.

 

     The gel does not require secondary curing and is an excellent solution for applications where the risks associated with silicone oil migration or contamination must be reduced, or for devices manufactured in silicon-free facilities. "The global electronics assembly and manufacturing ecosystem continues to employ strict material controls," explains Nudelman. "Coupled with advances in optical data transmission, electric vehicle (EV) technology and state-of-the-art sensors, our latest thermal materials have virtually unlimited applications."

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