The smallest 3D image sensor from Infineon

     3D depth sensors, which enable reliable face recognition, improved photo capabilities and realistic augmented reality experiences, play a key role in smartphones and applications that rely on accurate 3D image data. Infineon Technologies AG and pmdtechnologies AG, which specializes in software and 3D time-of-flight systems, have developed the world's smallest and most powerful 3D image sensor, the new REAL3Measuring just 4.4 x 5.1 mm, the single-chip solution is the fifth-generation time-of-flight depth sensor successfully developed by Infineon. Thanks to its small size, it can be integrated into even the smallest devices consisting of only a few components, and in addition, the chip can provide the highest resolution data at low power consumption.

     Andreas Urschitz, President of Infineon's Power Management and Diversified Markets Division, said: "With the 5th generation REAL3? With the chip, we have once again proved Infineon's leading position in the field of 3D sensors. It is robust, reliable, powerful, energy efficient and very small. The range of applications for security, using images and context-based interaction with devices will continue to grow steadily, so we see huge growth potential for 3D sensors." The 3D sensor also supports controlling the device through gestures, so it enables contactless context-based human-computer interaction.

     Depth sensor time-of-flight technology can accurately generate 3D images of faces, hand details or related objects when it is necessary to ensure that the image matches the original image. It is already being used in payment transactions that take place on mobile phones or other devices, which do not require bank details, cards or cashiers, but instead use facial recognition. Therefore, it is inseparable from extremely safe and reliable images and high-resolution 3D image data return. The same applies to using 3D images to unlock devices securely. In addition, Infineon 3D image sensors are particularly suitable for extreme lighting conditions, such as in strong sunlight or dark scenes.

     Not only that, the chip also brings more options for the camera to take difficult photos, such as enhanced autofocus, photo and video background blur, and improve resolution in poor lighting conditions. Real time full 3D projection for a real augmented reality experience.