Thought3D's Pro HT backplane adhesive can meet all users' requirements for high temperature fuse 3D printing's strong adhesion

     Thought3D's MAGIGOO Pro HT 50ml/1.69 fl oz adhesive is designed for professional use and works at high print temperatures. Parts are relatively easy to remove after cooling, and glue residues are also easy to clean.

     Compared with ordinary thermoplastics, high-temperature materials such as polyether ether ketone (PEEK) are advanced engineering thermoplastics, which can provide better mechanical and chemical stability at high temperatures. Other materials include polyether ketone ketone ketone (PEKK), polyetherimide, polyphenylsulfone (PPSU) and their carbon/glass fiber reinforced counterparts. Because of their high temperature and other special properties, these materials are highly sought after in high temperature and high-performance engineering applications, such as automotive and aerospace industries, as well as chemical, petrochemical, medical and research applications.

     High temperature fuses have proven to be more challenging FDM printing materials because they have a higher tendency to warp. Because of their high temperature properties, these materials are usually printed at high temperatures. MAGIGOO HT is a special solution for PEEK fuse FDM printing, which is specially developed for working at high temperatures.

     MAGIGOO HT is designed and tested to operate at a base plate temperature of+150 ° C or lower; Simply shake the bottle, apply Flex adhesive, print, cool and remove, and clean.

 
     MAGIGOO HT is designed for glass surfaces, but also for high-temperature Garolite and other construction surfaces. Using this product with fuses other than PEEK fuses may cause excessive adhesion and damage to the constructed surface. Follow the instructions in the technical data sheet for best results. For larger prints, a 20 mm edge is recommended