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Ti's complete Bluetooth BR/EDR/LE HCI solution reduces design effort, cost and time to market

Dec 14 2022 2022-12 Semiconductors Texas Instruments
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The CC2564MODx module of Texas Instruments is a complete Bluetooth BR/EDR and low-power HCI solution, which reduces the design workload, cost and time to market. CC2564MODx module includes the 7th generation core of TI, and provides a universal, product proven solution compatible with Bluetooth 4.1

     Texas Instruments' CC2564MODx module is a complete Bluetooth BR/EDR and low power HCI solution that reduces design effort, cost and time to market. The CC2564MODx module includes the 7th generation core of TI and provides a universal, product-proven solution compatible with Bluetooth 4.1. These modules are FCC certified, IC and CE certified and no prior RF experience is required to develop these devices.

 

     CC2564MODx includes a royalty-free software stack that is compatible with several host MCUS and cpus. The device delivers best-in-class RF performance, transmit power and receive sensitivity providing twice the range and higher throughput than other Bluetooth low energy solutions.

 

     TI's MSP430 and MSP432 Arm Cortex-M3 and Arm Cortex-M4 MCUS, as well as Linux-based MPUs' dual-mode Bluetooth stack software are certified and offered free of license fees. Other processors are available through TI's third-party support. The iPod (MFi) protocol is supported by additional software packages.

 

     Protocols and sample applications include a serial port profile (SPP), an Advanced Audio Distribution Profile (A2DP), an audio/Video Remote Control Profile (AVRCP), a Handheld Free Profile (HFP), a human-machine Interface Device (HID), a General Properties Profile (GATT), and several Bluetooth low power profiles and services. BOOST-CC2564MODA and CC2564MODxEM Evaluation boards are available for each model.

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