Toshiba adds UFS support for BiCS FLASH to its range of embedded flash products

     Toshiba Memory Corporation announced that it has started sample shipments of its new automotive JEDEC UFS version 2.1 embedded memory solution using 3D flash memory . These new products are embedded FLASH devices that integrate the company's BiCS FLASH™ 3D flash and controller in a single package. Sequential read and write performance improved by approximately 6% and 33%, respectively, over existing devices.

     The company's automotive UFS support a wide temperature range (-40°C to +105°C), meeting the requirements of AEC-Q100 Grade2 and providing the higher reliability required for a variety of automotive applications. The series is available in four storage capacities: 32GB, 64GB, 128GB and 256GB. 

     The new UFS device has a variety of functions to meet the requirements of automotive applications such as refresh, thermal control and extended diagnostics. The refresh function can be used to refresh data stored in UFS, helping to extend the life cycle of the data. The thermal control function provides overheating protection for the device in the high temperature conditions that automotive applications may face. Finally, extended diagnostics help users easily understand device status.

     Technological advances in products related to automotive infotainment systems and advanced driver assistance systems [6] to enable connected and autonomous vehicles will continue to drive up storage requirements for automotive applications. As these demands continue to grow, Toshiba Memory Corporation will enhance its product lineup of high-performance, large-capacity memory solutions for automotive applications to continue its market leadership.