Toshiba has been deeply engaged in the field of electronic components for many years, and its voltage resistant small switching diode products have been attracting market attention. The recently launched new product "HN1D05FE" of 400 V voltage resistant switching diodes covers a wide range of fields from consumer equipment to industrial equipment, such as home appliances, personal computers, photovoltetics, semiconductor manufacturing equipment, and so on.
The HN1D05FE is a small voltage resistant switching diode suitable for applications requiring high voltage characteristics. For example, in commercial AC power circuits, HN1D05FE can withstand the impact of high voltages, effectively protecting other components in the circuit from damage. Its unique structure and manufacturing process enables it to maintain a low loss and high efficiency working state under high pressure environments, thereby improving the performance and stability of the entire power circuit. At the same time, the high voltage resistance also makes this product ideal for AC-DC converter circuits in LED lighting.
Not only that, in the AC-DC converter circuit of LED lighting, HN1D05FE also plays an important role. LED lighting products have extremely high requirements for power quality, requiring stable current and voltage input to ensure the stability and life of the lighting effect. HN1D05FE's high voltage resistance and stable working performance make it able to play a key role in AC-DC converter circuits to provide stable and reliable power support for LED lighting products.
In addition, the HN1D05FE has a 400 V reverse voltage rating, suitable for power supply circuits up to 200 V, as well as reverse current protection, surge protection, etc. The SOT-563 package is used to achieve high voltage characteristics through small size. Two built-in switching diodes reduce the number of devices in circuits that use multiple devices. In addition, compared with the SOT-24 package of Toshiba's existing product 1SS399 (Toshiba package name: SMQ, 2.9mm × 2.9mm (typical value), thickness = 1.1mm (typical value)), the package size is reduced by about 70% and the package height is reduced by 50%, which contributes to the miniaturization of the device.
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