Toshiba introduces a 40V N-channel power MOSFET with a new type of high heat dissipation package

     Toshiba Electronics Components and Storage Corporation announced the launch of a new 40V n-channel power Mosfets for vehicle in L-TOGL (large transistor profile Gull-wing pin) package - "XPQR3004PB" and "XPQ1R004PB". Both MosFeTs have high drain current ratings and low on-resistance ratings.

     In recent years, as demand for electric vehicles has increased, so has industry demand for components that can meet the greater power consumption of on-board devices. The new models feature Toshiba's new L-TOGL package that supports high current, low on-resistance, and high heat dissipation. Instead of using an internal terminal  structure, the above product integrates the source connector with the external pin by introducing a copper clip. The multi-pin structure of the source pin reduces the package resistance by approximately 30% compared TO the existing TO-220sm (W) package, thus increasing the drain current rating (DC) of XPQR3004PB to 400A, 1.6 times higher than the current product . The use of thick copper frames reduces the channel-to-housing thermal resistance in XPQR3004PB to 50% of the current product . These characteristics help to achieve greater current and reduce on-board equipment losses.

     With new packaging technology, the new product further simplifies heat dissipation design, significantly reducing the number of MosFeTs required for high-current applications such as semiconductor relays and all-integrated starter generator converters, thereby helping systems reduce device size. When multiple devices need to be connected in parallel to provide greater operating current for the application, Toshiba supports grouping of these two new products, that is, grouping products by gate threshold voltage. This ensures that the design uses the same group of products, thus reducing characteristic bias.

     Because on-board equipment may operate in a variety of temperature environments, surface mount solder joint reliability is a key factor to consider. New products adopt gull wing pin to reduce mounting stress and improve solder joint reliability. Toshiba has introduced a new high cooling package of 40V N channel power MosFETs for on-board vehicles to support higher current requirements for on-board devices