Toshiba unveils smart power devices that help reduce mounting area

     Electronic Components and Memory Devices Corporation (" Toshiba ") announced the launch of two smart power devices - "TPD2015FN" and "TPD2017FN" - for controlling the drive of inductive loads used in motors, solenos, lamps and other applications such as programmable logic controllers for industrial equipment. High side switch (8 channels) "TPD2015FN" and low side switch (8 channels) "TPD2017FN"

     The new product uses Toshiba's emulator Piece integration process (BiCD)  to achieve an on-off resistance of 0.4Ω (typical value), more than 50% lower than Toshiba's existing product . Both TPD2015FN and TPD2017FN adopt SSOP30 package [3], whose mounting area is about 71% of that of SSOP24[4] package used in existing products, and its height is 80% of that of SSOP24 package. Meanwhile, the pin spacing is reduced to 0.65mm. These improvements help to reduce the design size.

     The maximum operating temperature of the new product is 110℃, higher than the 85℃ of the existing product [2], which supports applications with higher operating temperature. In addition, the two new products also have built-in overcurrent protection and overheating protection circuits, which help improve the reliability of the design.