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Transphorm introduces the industry's first TOLT gallium nitride transistor with top-heat dissipation

Dec 7 2023 2023-12 Passive Components Transphorm
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Following the introduction of three new TOLL FETs, Transphorm has introduced a new SuperGaN FET in TOLT package form. Further enriching Transphorm's product line and demonstrating the market commitment of the Transphorm SuperGaN platform to support customer applications with "Gallium" in various package forms at full power.

     Transphorm has announced a new SuperGaN FET in TOLT package form. The new TP65H070G4RS transistor has an on-resistance of 72 mm and is the industry's first top-cooling, surface-mount gallium nitride device in the JEDEC standard (MO-332) TOLT package. The TOLT package provides customers with a more flexible thermal management solution for systems that are not suitable for the use of traditional bottom-cooled surface mount devices. The TOLT package not only offers thermal performance comparable TO the widely used, thermally stable TO-247 jack package, but also has the added advantage of efficient manufacturing processes for SMD-based printed circuit board assembly (PCBA).

 

     The TP65H070G4RS uses Transphorm's powerful, high-performance 650 V normally closed d-mode gallium nitride platform, which has lower gate charge, output capacitance, cross loss, reverse recovery charge, and dynamic resistance, resulting in superior efficiency over silicon, SIC, and other gallium nitride products. The benefits of the SuperGaN platform, combined with the better heat dissipation and system assembly flexibility of the TOLT package, provide a high-performance, highly reliable GaN solution for customers seeking to introduce power systems with higher power density and efficiency and lower overall power system cost.

 

     Transphorm is working with multiple high-power GaN partners around the world, including leading customers in server and storage power supplies, global leaders in energy/microinverters, manufacturers of innovative off-grid power solutions, and leaders in satellite communications.

 

     Philip Zuk, senior vice president of business development and marketing at Transphorm, said: "Surface-mount devices such as TOLL and TOLT offer many advantages, including reduced internal inductance and easier on-board installation during manufacturing. TOLT provides more flexible overall thermal management by adopting top heat dissipation, with jack-like heat dissipation performance. These devices are typically used in medium to high power system applications, with key market segments including high performance computing (servers, telecommunications, AI power supplies), renewable energy and industrial, and electric vehicles. Transphorm's gallium nitride technology is already being used in some of these market applications. We are excited to help our customers realize additional system-level benefits with the TOLT SuperGaN solution."

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