TriLumina introduces a 3 W surface-mount flip chip backlaunch VCSEL array without a pedestal

     TriLumina, a leading developer of flip-chip vertical cavity surface-emitting laser (VCSEL) technology for 3D sensing applications, has announced the world's first 3W surface-mount flip-chip back-emitting VCSEL array, which eliminates the need to move package bases or bonding wires for 3D sensing cameras. Compared to traditional VCsels for 3D sensing, this new on-board VCSEL(VoB) technology enables higher performance, smaller size and lower cost, and simplifies the time-of-flight (ToF) camera supply chain.

     Brian Wong, President and CEO of TriLumina, said, "We are excited to launch 4W VoB for automotive applications this past summer. Now, with the new 3W flip chip VoB, TriLumina has created a smaller specification that delivers a thinner, smaller, and higher performance solution than regular top-launch VCsels dedicated to mobile ToF applications."

     Traditional VCSEL arrays are mounted on a base and electrically connected using bonding wires. The new 3 W VoB surface-mount Technology (SMT) device has a compact, surface-mountable design consisting of a single VCSEL array chip that is welded to a printed circuit board (PCB) with standard SMT backmount, eliminating the need for simultaneous use with other SMT components on the same printed circuit board in the base vehicle of the VCSEL chip. TriLumina's integrated backetched microlens technology enables integrated optics that further reduce device height compared to traditional VCsels with separate optical lenses. It has the smallest space and the lowest cost of its kind, making it ideal for all types of mobile devices.

     While direct flip chip SMT technology has been used in other components such as radio frequency (RF) and power Field effect tube (FET) chips, TriLumina's VoB is the first time this technology has been used on VCSEL devices. The VCSEL device uses copper columns with solder bumps currently used in other types of products and is mounted directly onto a printed circuit board using standard lead-free SMT, with advantages such as built-in sealing and excellent thermal performance thanks to TriLumina's unique backfired VCSEL construction. Sampling of the VoB series is now underway. Please contact TriLumina for data sheets and additional technical and pricing information.