Two-in-one sensors that save space and power on in-ear and headsets

     The STMicroelectronics LSM6DSV16BX is a one-of-a-kind, highly integrated sensor that saves a lot of space for sports earbuds and universal in-ear headphones. Integrated on the chip are a 6-axis inertial measurement unit (IMU), which tracks the head and detects human movement, and an audio accelerometer, which uses bone conduction technology to detect speech over a frequency range of 1KHz.

     The LSM6DSV16BX also brings great functionality to the headset, while the chip integration reaches an unprecedented high. The chip is built with low-power Sensor Fusion (SFLP) technology, which was designed by stmicroelectronics specifically for 3D audio head tracking. These technical features help reduce system latency while reducing overall power consumption and host processor load.

     The LSM6DSV16BX comes in a 2.5mm x 3.0mm x 0.74mm VFLGA package. Higher integration combined with edge processing technology can save up to 70% of system power consumption and 45% of PCB area. In addition, the number of pins is reduced by 50%, thus saving external components, and the package height is reduced by 14% compared to the previous ST MEMS inertial sensor.

     LSM6DSV16BX has a number of software examples available on FSM and MLC model zoo at ST MEMS GitHub, including pick up gesture detection for automatically opening certain device services, TWS earplug in and out ear detection, 3D headphone head posture detection, and more. To save developers time without having to start from scratch, the X-CUBE-MEMS1 package comes pre-integrated with application code samples.

     In addition, the LSM6DSV16BX includes the Qvar™ charge change detection technology to recognize user interface control gestures such as touch, swipe, etc. Ideal for true wireless stereo (TWS) headsets and products such as augmented reality, virtual reality and mixed reality (AR/VR/MR) headsets.