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U-blox launches MAYA-W2 "three in one" short-range communication module

Sep 26 2022 2022-09 Semiconductors Nichicon
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u-blox, a leading global provider of location and wireless communications technologies and services, announced the launch of the u-blox MAYA-W2 "Triple Play" short-range Communications Module supporting Wi-Fi 6, Bluetooth Low Power (LE) 5.2 and IEEE 802.15.4 (Thread and Zigbee), It is suitable for industrial automation, smart buildings, energy management, health care, smart home and other industrial applications, and takes the lead in applying Wi-Fi 6 technology to the industrial and consumer mass market.

     U-blox announced the launch of the u-blox MAYA-W2 "three in one" short-range communication module, which supports Wi Fi 6, low-power Bluetooth (LE) 5.2 and IEEE 802.15.4 (Thread and Zigbee). It is applicable to industrial automation, intelligent buildings, energy management, medical care, smart home and other industries, and takes the lead in applying Wi Fi 6 technology to the industrial and consumer mass markets.

 

     MAYA-W2 has advanced communication functions, so that your product design is not afraid of future challenges. Compared with the previous generation of Wi Fi standards, Wi Fi 6 (i.e. 802.11ax) can provide better network efficiency (especially in the channel congestion area), lower latency and greater coverage. In addition, Thread provides support for low-power, IP based mesh networks commonly used in home automation.

 

     MAYA-W2's dual mode Bluetooth can support both conventional Bluetooth and Bluetooth LE, including Bluetooth LE audio. With this new audio feature, the device can simultaneously send and receive multiple different audio streams, and broadcast audio streams to multiple users.

 

     MAYA-W2 provides all necessary Linux, Android and FreeRTOS software drivers through open source. FreeRTOS software drivers have been pre integrated into the MCUXpresso Software Development Kit (SDK), while Android and Linux software drivers have been pre integrated into the Development Board Support Kit (BSP) of the NXP i.MX application processor. This will improve product development efficiency, simplify software integration and testing, and thus shorten the time to market.

 

     Because MAYA-W2 and MAYA-W1 Wi Fi 4 modules are seamlessly compatible, product developers can easily upgrade the device from Wi Fi 4 to Wi Fi 6 without redevelopment and design, to meet the development needs of multiple product families with different performance requirements. MAYA-W2 industrial module has a working temperature range from - 40 ° C to 85 ° C, and has four models and three optional antennas, including antenna pin, U FL connector or PCB antenna, applicable to all kinds of Internet of Things equipment. Product developers can use the special evaluation kit (EVK) and M.2 card seamlessly connected to the host technology platform (including NXP's new i.MX development board series) to comprehensively evaluate the product performance.

 

     "The IW612 recently released by NXP is the first" three in one "IoT wireless chip in the industry, which can achieve seamless and safe communication in smart home and industrial application scenarios, and can well meet the needs of different ecosystems, including the new Matter protocol. As a gold medal partner of NXP, u-blox took the lead in using this innovative solution in its new MAYA-W2 module, which will help accelerate the research and development process of commercial terminal products and bring higher robustness, reliable and safe communication capabilities. "—— Tom Eichenberg,NXP Senior Marketing Director of Communications Technology Department of Semiconductors

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