Xilinx continues to lead at 16nm with new memory, 3D-on-3D and multiprocessing SoC technologies

     Xilinx Corporation, a global leader in All Programmable technologies and devices, announced that its 16nm UltraScale+ family of FPGas, 3D ics and MPsoCs has once again achieved a first-generation value advantage with new memory, 3D-on-3D and multi-processing SoC(MPSoC) technologies. For even higher performance and integration, the UltraScale+ series also features a new connectivity optimization technology, SmartConnect.

     These new devices further extend Xilinx's UltraScale product family (now spanning from 20nm to 16nm FPgas, SoCs and 3D IC devices), while leveraging TSMC's 16FF+ FinFET 3D transistor technology to significantly improve the performance-to-power ratio. Through system-level optimization, UltraScale+ delivers value that far exceeds the value of traditional process node migration, improves system-level performance and power consumption by two to five times compared to 28nm devices, and achieves the highest level of system integration and intelligence, as well as the highest level of security.

     The newly expanded Xilinx UltraScale+ FPGA family includes Xilinx's market-leading Kintex UltraScale+ FPGas and Virtex UltraScale+ FPGas as well as the 3D IC family, The Zynq UltraScale+ family includes the industry's first fully programmable MPSoC. With this new product portfolio, Xilinx is able to meet a variety of next-generation application needs, including LTE Advanced, early 5G wireless, terabyte wired communications, automotive driver assistance systems, and Industrial Internet of Things (IoT) applications.

     Memory-enhanced programmable devices: With support for SRAM integration, UltraRAM addresses one of the biggest bottlenecks affecting the performance and power consumption of FPGA and SoC systems. This new technology enables the creation of on-chip memory for a variety of different application scenarios, including deep packets and video buffering, with predictable latency and performance. By tightly integrating a large number of embedded memory and associated processing engines, designers can not only achieve a higher system performance-to-power ratio, but also reduce bill of materials (BOM) costs. UltraRAM is available in a variety of configurations with capacity expandable up to 432 Mb.

     SmartConnect Technology: SmartConnect is a new innovative FPGA interconnection optimization technology that provides an additional 20 to 30 percent performance, area, and power benefits through intelligent system-level interconnection optimization. While the UltraScale architecture addresses chip-level connectivity bottlenecks by rewiring, clock and logic architecture, SmartConnect applies interconnection topology optimization to meet the throughput and latency requirements of specific designs while reducing the interconnection logic area.

     The industry's first 3D-on-3D technology: The premium UltraScale+ series combines the combined power benefits of 3D transistors and Xilinx's third-generation 3D ics. Just as FinFET achieves a nonlinear increase in performance-power ratio compared to planar transistors, 3D ics achieve a nonlinear increase in system integration and unit power bandwidth compared to a single device.

     Heterogeneous multiprocessing technology: The new Zynq UltraScale MPSoC enables unprecedented heterogeneous multiprocessing capabilities by deploying all of the above FPGA technologies, enabling "the right engine for the right task." These new devices increase system-level performance and power consumption by approximately five times compared to previous solutions. At the center of the processing subsystem is a 64-bit quad-core ARM Cortex-A53 processor that enables hardware virtualization and asymmetric processing, with full support for ARM® TrustZone.

     The processing subsystem also includes a dual-core ARM Cortex®-R5 real-time processor that supports deterministic operations, ensuring real-time response, high throughput and low latency for the highest level of security and reliability. A single security unit enables military-grade security solutions such as secure startup, key and library management, and anti-breach capabilities, which are standard requirements for inter-device communication and industrial iot applications.

     For full graphics acceleration and video compression/decompression, the new device integrates the ARM Mali -400MP dedicated graphics processor and H.265 video codec unit, as well as support for Displayport, MIPI and HDMI. Finally, the new device adds a dedicated platform and power management unit (PMU) that supports system monitoring, system management, and dynamic power gating for each processing engine.

     Victor Peng, executive vice president and general manager of Xylinx Programmable Products, said: "For a variety of next-generation applications, Xylinx's 16nm FinFET FPGas and MPsoCs can provide a first-generation value advantage. Our new UltraScale+ 16nm portfolio offers two to five times higher system performance to power ratio, a quantum leap in system integration and intelligence, and the highest levels of confidentiality and security our customers demand. These capabilities significantly expand Xilinx's existing market."

     "The continuous collaboration between TSMC and Xallinx has resulted in a world-class 16nm FinFET product family, and together we have clearly demonstrated industry-leading chip performance with the lowest power consumption and highest system value," said Dr. Ping Chung Jin, Vice president, Business Development, TSMC.