Xilinx introduces new Artix and Zynq UltraScale+ devices

Xilinx, the leader in adaptive computing, announced the expansion of its UltraScale+ portfolio to the market to support new applications requiring ultra-compact and intelligent edge solutions. The new Artix and Zynq UltraScale+ devices are 70% smaller in form size than traditional chip packages and can meet a wider range of applications in the industrial, visual, medical, broadcast, consumer, automotive and connected markets.

As the world's only hardware flexible and cost-optimized portfolio based on 16nm technology, Artix and Zynq UltraScale+ devices feature TSMC's most advanced InFO (Integrated Fan Out) packaging technology. With InFO technology, Artix and Zynq UltraScale+ devices deliver high compute density, excellent performance-to-power ratio, and scalability in a compact package to meet the needs of intelligent edge applications.

Sumit Shah, Senior Director of Product line Management and Marketing at Xilinx, said: "The need for compact, intelligent edge applications is driving the need for processing and bandwidth engines. These engines must not only provide higher performance, but also a higher level of compute density to support the smallest size systems. The UltraScale+ series brings a strong boost to the new cost-optimized products. It builds on Xilinx UltraScale+ FPGA and MPSoC architectures and production-proven technologies that are already deployed in millions of systems around the world."

Artix UltraScale+ FPGA: Designed for high I/O bandwidth and DSP computing

Based on a production-proven FPGA architecture, the Artix UltraScale+ family is ideal for a range of applications, such as machine vision with advanced sensor technology, high-speed interconnectivity, and ultra-compact "8K-ready" video broadcasting. The Artix UltraScale+ device offers a 16Gb per second transceiver that supports emerging high-end protocols in connectivity, vision and video, while delivering best-in-class DSP computing capabilities.

Zynq UltraScale+ MPSoC: Optimized for power consumption and cost

The cost-optimized Zynq UltraScale+ MPSoC includes the new ZU1 and production-proven ZU2 and ZU3 devices, all in the InFO package. As part of the Zynq UltraScale+ family of multiprocessing SoCs, ZU1 is designed for edge connectivity and industrial and medical iot systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, handheld test devices, and consumer and medical applications. ZU1 is designed for miniaturized, compute-intensive applications and uses a multi-core processor subsystem based on a heterogeneous Arm® processor, while also being able to migrate to a common package size to support higher computing power.

Rod Barman, founder and President of LUCID Vision Labs, said: "LUCID worked closely with Xilinx to integrate the new UltraScale+ ZU3 into our next generation industrial machine vision camera, Triton™ Edge. "With the UltraScale+ ZU3 and its InFO package, LUCID can leverage an innovative rigid flex board architecture to squeeze incredible processing power into a factory grade, rugged, ultra-compact IP67 camera."

Scalable and secure Artix and Zynq UltraScale+

With the addition of the new Artix devices and the expansion of the Zynq UltraScale+ family, Xilinx's product portfolio now ranges from the Virtex® UltraScale+ high-end series, the Kintex UltraScale+ mid-range series, to the new cost-optimized low-end series. The new device completes the Xylinx product portfolio and provides customers with the scalability to develop multiple solutions using the same Xylinx platform. This preserves design investment across product portfolios and accelerates time to market.

Safety is a key component of Xilinx's design. The new devices in the cost-optimized Artix and Zynq UltraScale+ families feature the same robust security features as the UltraScale+ platform, including RSA-4096 authentication, AES-CGM decryption, Data Protection Law (DPA), and more. And Xilinx's proprietary Security Monitor (SecMon) IP provides flexibility to address security threats throughout the product lifecycle and meet the security needs of commercial projects.

Dan Mandell, senior analyst for iot and Embedded technologies at VDC Research, said: "The ability for customers to scale their design solutions to a wide range of applications and market needs with a single, secure platform is critical to enabling easier design integration and capturing critical time-to-market opportunities. Xilinx's strategy to expand its portfolio to address these market needs with the scalable and secure UltraScale+ Artix and Zynq families is attractive, especially given the significant opportunities in the growth markets where these solutions are being deployed."