xMEMS launches 1mm ultra-thin "Air-cooled all-silicon active cooling chip" suitable for mobile phone and AI chip integration

     xMEMS Labs, a pioneer in piezoelectric MEMS innovation and creator of the world's leading all-silicon micro-speakers, today announced its latest industry-changing innovation: The xMEMS XMC-2400 µCoolingTM chip, the first all-silicon micro-air-cooled active cooling chip, is designed for ultraportable devices and next-generation artificial intelligence (AI) solutions. With chip-level active, fan-based microcooling solutions, manufacturers can be the first to incorporate active cooling into smartphones, tablets and other advanced portable devices with the silent, vibration-free, solid-state xMEMS XMC-2400 µCoolingTM. The XMC-2400 µCoolingTM chip is just 1 mm thick.

     "Our revolutionary µCooling 'fan chip' design comes at a critical time for mobile computing," said Joseph Jiang, CEO and co-founder of xMEMS. "An increasing number of processor-intensive AI applications are running in ultraportable devices, creating significant thermal management challenges for manufacturers and consumers alike. "Before the XMC-2400, there was no active cooling solution because these electronics were so small and thin."

     Measuring just 9.26 x 7.6 x 1.08mm and weighing less than 150 mg, the XMC-2400 is 96 percent smaller and lighter than non-silicon-based active cooling alternatives. A single XMC-2400 chip can move up to 39 cubic centimeters of air per second at a back pressure of 1,000Pa. This all-silicon solution provides semiconductor reliability, consistency between components, high robustness, high crashworthiness and an IP58 dust and water resistance rating.

     The xMEMS µCooling is based on the same manufacturing process as the award-winning ultrasonic sounding xMEMS Cypress full-frequency micro speaker for in-ear wireless earplugs with ANC capabilities and is set to enter production in the second quarter of 2025, with multiple customers already committed to adoption. xMEMS plans to offer samples of XMC-2400 to customers in the first quarter of 2025.

     "We introduced MEMS micro speakers to the consumer electronics market and shipped more than half a million in the first half of 2024," said Joseph. "With µCooling, we are changing the way people think about thermal management. The XMC-2400 is designed to actively cool even the smallest handheld devices for the thinnest, most efficient, AI-enabled mobile devices. It's hard to imagine tomorrow's smartphones and other thin, performance-oriented devices without µCooling technology."