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| Part Number | XCZU5EG-L2FBVB900E |
| OEMstron Part # | XCZU5EG-L2FBVB900E |
| Manufacturer | Xilinx |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Description | IC SOC CORTEX-A53 900FCBGA |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | XCZU5EG-L2FBVB900E PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | Nov 25 - Nov 30 (Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |  |
| Shipping |  |
XCZU5EG-L2FBVB900E Specifications
| Part Number | XCZU5EG-L2FBVB900E | |
| Brand | Xilinx | |
| Lifecycle | Active | |
| RoHS | No RoHS Information | |
| Product Line | Semiconductors | |
| Category | Embedded Processors & Controllers | |
| Subcategory | SoC (System On Chip) | |
| Manufacturer | Xilinx Inc. | |
| Series | Zynq® UltraScale+™ MPSoC EG | |
| Architecture | MCU, FPGA | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
| Flash Size | - | |
| RAM Size | 256KB | |
| Peripherals | DMA, WDT | |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Speed | 533MHz, 600MHz, 1.3GHz | |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | |
| Operating Temperature | 0°C ~ 100°C (TJ) | |
| Package / Case | 900-BBGA, FCBGA | |
| Supplier Device Package | 900-FCBGA (31x31) |
XCZU5EG-L2FBVB900E Documents
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Global Supply Chains - Reliable and Authorized Distributor Resources
| Part Number | Description | Stock |
|
XCZU5EG-L2FBVB900E D# XCZU5EG-L2FBVB900E Xilinx |
Zynq UltraScale+ MPSoC FPGA General Purpose Engine Low Power 256200 Logic Cells Quad APU Flip-chip with 1mm Ball Pitch 900-Ball FCBGA Tray - Trays (Alt: XCZU5EG-L2FBVB900E) |
Americas - 0 |
| Part Number | Description | Stock |
|
XCZU5EG-L2FBVB900E D# XCZU5EG-L2FBVB900E-ND Xilinx |
IC SOC CORTEX-A53 900FCBGA |
Temporarily Out of Stock |
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