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CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)

Records 2,134

Page 30/72

Part Number	Manufacturer	Description	In Stock	Series	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
XAZU3EG-1SFVA625Q	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock104 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.8MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 125°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
XCZU3EG-2SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock241 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU3EG-L1SFVC784I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock141 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
A2F500M3G-1FGG256M	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA	In Stock231 More on Order	Series: SmartFusion®	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART	Speed: 100MHz	Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	Operating Temperature: -55°C ~ 125°C (TJ)	Package / Case: 256-LBGA	Supplier Device Package: 256-FPBGA (17x17)
XAZU3EG-1SFVC784Q	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock375 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.8MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 125°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
A2F500M3G-1FG484M	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 484FBGA	In Stock281 More on Order	Series: SmartFusion®	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART	Speed: 100MHz	Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	Operating Temperature: -55°C ~ 125°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
A2F500M3G-1FGG484M	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 484FBGA	In Stock253 More on Order	Series: SmartFusion®	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART	Speed: 100MHz	Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	Operating Temperature: -55°C ~ 125°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
XCZU3EG-2SBVA484I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA	In Stock345 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BFBGA, FCBGA	Supplier Device Package: 484-FCBGA (19x19)
XCZU3EG-L2SBVA484E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA	In Stock200 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 484-BFBGA, FCBGA	Supplier Device Package: 484-FCBGA (19x19)
XCZU3EG-2SFVA625I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock457 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
XCZU3EG-L2SFVA625E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock181 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
XCZU3EG-2SFVC784I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock215 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU3EG-L2SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock190 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU4CG-1SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock148 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XC7Z035-1FBG676C	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 676FCBGA	In Stock322 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 667MHz	Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BBGA, FCBGA	Supplier Device Package: 676-FCBGA (27x27)
XCZU4CG-1FBVB900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock262 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU4CG-2SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock214 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU4CG-L1SFVC784I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock158 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU4EG-1SFVC784I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock250 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XC7Z035-1FBG676I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 676FCBGA	In Stock269 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 667MHz	Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BBGA, FCBGA	Supplier Device Package: 676-FCBGA (27x27)
XC7Z045-1FBG676C	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 676FCBGA	In Stock469 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 667MHz	Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BBGA, FCBGA	Supplier Device Package: 676-FCBGA (27x27)
XC7Z035-1FFG676C	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 676FCBGA	In Stock397 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 667MHz	Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BBGA, FCBGA	Supplier Device Package: 676-FCBGA (27x27)
XCZU4EG-1FBVB900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock217 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU4EV-1SFVC784I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock171 More on Order	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU5CG-1SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock100 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU4EG-2SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock455 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU4EG-L1SFVC784I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock470 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU4CG-L2SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock167 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XC7Z035-2FBG676E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA	In Stock367 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 676-BBGA, FCBGA	Supplier Device Package: 676-FCBGA (27x27)
XCZU4CG-1FBVB900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock211 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)

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