Support
sales@oemstron.com
86-755-83232896
English$ USD
Contact Us
TELEPHONE86-755-83232896
E-MAILsales@oemstron.com
SKYPEcondy@oemstron.com
QQ2881672436
MessageLeave Your Message
Top

SoC (System On Chip)

Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Show Filters
Reset Filters
Apply Filters
CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)
Records 2,134
Page 31/72
Image
Part Number
Manufacturer
Description
In Stock
Quantity
Series
Architecture
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
XCZU4EV-1FBVB900E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock106

More on Order

Series: Zynq® UltraScale+™ MPSoC EV
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XCZU5EG-1SFVC784E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock379

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XC7Z035-1FFG900C
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 900FCBGA

In Stock102

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XC7Z035-2FBG676I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

In Stock166

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
XCZU4EV-2SFVC784E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock282

More on Order

Series: Zynq® UltraScale+™ MPSoC EV
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XCZU4EV-L1SFVC784I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock241

More on Order

Series: Zynq® UltraScale+™ MPSoC EV
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XC7Z045-1FBG676I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 676FCBGA

In Stock257

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
XCZU4EG-2SFVC784I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock235

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XCZU4EG-L2SFVC784E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock172

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XC7Z035-1FFG676I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 676FCBGA

In Stock381

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
XCZU5EV-1SFVC784E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock404

More on Order

Series: Zynq® UltraScale+™ MPSoC EV
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XCZU4CG-2FBVB900E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock279

More on Order

Series: Zynq® UltraScale+™ MPSoC CG
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XCZU4CG-L1FBVB900I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock178

More on Order

Series: Zynq® UltraScale+™ MPSoC CG
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XCZU4EG-1FBVB900I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock200

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XCZU5CG-1SFVC784I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock342

More on Order

Series: Zynq® UltraScale+™ MPSoC CG
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XC7Z035-3FBG676E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

In Stock262

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
XC7Z035-L2FBG676I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

In Stock401

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
XCZU4EV-2SFVC784I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock198

More on Order

Series: Zynq® UltraScale+™ MPSoC EV
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XCZU4EV-L2SFVC784E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock249

More on Order

Series: Zynq® UltraScale+™ MPSoC EV
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XC7Z045-2FBG676E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

In Stock276

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
XC7Z035-1FFG900I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 900FCBGA

In Stock249

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XC7Z035-2FFG676E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

In Stock325

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
XC7Z045-2FBG676I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

In Stock328

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
XCZU4EV-1FBVB900I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock133

More on Order

Series: Zynq® UltraScale+™ MPSoC EV
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XCZU5CG-1FBVB900E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock212

More on Order

Series: Zynq® UltraScale+™ MPSoC CG
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XCZU4EG-2FBVB900E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock263

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XCZU4EG-L1FBVB900I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock255

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XCZU5EG-1SFVC784I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock421

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
XCZU4CG-2FBVB900I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock138

More on Order

Series: Zynq® UltraScale+™ MPSoC CG
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XCZU4CG-L2FBVB900E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 900FCBGA

In Stock320

More on Order

Series: Zynq® UltraScale+™ MPSoC CG
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)