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CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)

Records 2,134

Page 34/72

Part Number	Manufacturer	Description	In Stock	Series	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
XCZU7CG-1FBVB900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock113 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU7EV-1FFVC1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock381 More on Order	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU4EV-3FBVB900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock305 More on Order	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU5EG-3SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock231 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU9CG-1FFVB1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock293 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU6CG-2FFVC900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock438 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU6CG-L1FFVC900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock222 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU5CG-2FBVB900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock166 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU5CG-L2FBVB900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock386 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU6CG-1FFVB1156I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock142 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XC7Z045-3FFV676E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 1GHZ 676FCBGA	In Stock159 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 1GHz	Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 676-BBGA, FCBGA	Supplier Device Package: 676-FCBGA (27x27)
XCZU7EV-1FFVF1517E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA	In Stock381 More on Order	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1517-BBGA, FCBGA	Supplier Device Package: 1517-FCBGA (40x40)
XC7Z045-3FFG900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 1GHZ 900FCBGA	In Stock490 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 1GHz	Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XC7Z045-L2FFG900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA	In Stock288 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU7EG-1FBVB900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock425 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU5EV-2FBVB900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock458 More on Order	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU5EV-L1FBVB900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock497 More on Order	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU5EV-3SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock441 More on Order	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU9EG-1FFVB1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock303 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XC7Z045-2FF900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA	In Stock255 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU6EG-2FFVC900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock262 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU6EG-L1FFVC900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock153 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU7CG-1FFVC1156I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock209 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU6EG-1FFVB1156I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock341 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU7CG-2FBVB900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock249 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU7CG-L1FBVB900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock384 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU9CG-1FFVC900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock195 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU7EV-1FBVB900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock250 More on Order	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XC7Z100-1FFG1156I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 1156BGA	In Stock280 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 667MHz	Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XC7Z100-1FF900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 900FCBGA	In Stock216 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 667MHz	Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)

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