Image |
Part Number |
Manufacturer |
Description |
In Stock |
Quantity |
Series | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock144 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock129 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock211 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock151 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock168 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock291 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 766MHZ 485CSBGA |
In Stock361 More on Order |
|
Series: Zynq®-7000 |
Architecture: MCU, FPGA |
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 766MHz |
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 484-LFBGA, CSPBGA |
Supplier Device Package: 485-CSBGA (19x19) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA |
In Stock313 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 90K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 325-TFBGA, CSPBGA |
Supplier Device Package: 325-CSPBGA (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA |
In Stock206 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 90K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 325-TFBGA, CSPBGA |
Supplier Device Package: 325-CSPBGA (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA |
In Stock263 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 90K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 325-TFBGA, CSPBGA |
Supplier Device Package: 325-CSPBGA (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA |
In Stock233 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 90K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 325-TFBGA, CSPBGA |
Supplier Device Package: 325-CSPBGA (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock104 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock285 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock426 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock189 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock175 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock166 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA |
In Stock133 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 400-LFBGA |
Supplier Device Package: 400-VFBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA |
In Stock427 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 400-LFBGA |
Supplier Device Package: 400-VFBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA |
In Stock482 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 400-LFBGA |
Supplier Device Package: 400-VFBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA |
In Stock401 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 400-LFBGA |
Supplier Device Package: 400-VFBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA |
In Stock128 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 400-LFBGA |
Supplier Device Package: 400-VFBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA |
In Stock165 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 400-LFBGA |
Supplier Device Package: 400-VFBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA |
In Stock482 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA |
In Stock221 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA |
In Stock416 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA |
In Stock216 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock104 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock311 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA |
In Stock413 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 400-LFBGA |
Supplier Device Package: 400-VFBGA (17x17) |