Support
sales@oemstron.com
86-755-83232896
English$ USD
Contact Us
TELEPHONE86-755-83232896
E-MAILsales@oemstron.com
SKYPEcondy@oemstron.com
QQ2881672436
MessageLeave Your Message
Top

SoC (System On Chip)

Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Show Filters
Reset Filters
Apply Filters
CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)
Records 2,134
Page 22/72
Image
Part Number
Manufacturer
Description
In Stock
Quantity
Series
Architecture
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
M2S060T-1FGG676I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock410

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1FG676
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock134

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1FGG676
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock370

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S060TS-FG676I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock314

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S060TS-FGG676I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock428

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1FG484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock353

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-1FGG484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock233

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
XC7Z020-L1CLG400I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 400BGA

In Stock253

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA, CSPBGA
Supplier Device Package: 400-CSPBGA (17x17)
M2S090-FG484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock172

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S090-FGG484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock428

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-1FG676I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock429

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1FGG676I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock333

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S050T-1FG896I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock389

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050T-1FGG896I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock180

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050TS-1FG896
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock396

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050TS-1FGG896
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock187

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050TS-FG896I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock422

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050TS-FGG896I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock297

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S090T-1FCS325I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock258

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090T-1FCSG325I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock499

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-1FCS325
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock436

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-1FCSG325
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock274

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-FCS325I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock487

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-FCSG325I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock199

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
XC7Z020-L1CLG484I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 484BGA

In Stock218

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-LFBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)
M2S090-FG676
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock135

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S090-FGG676
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock223

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1VFG400T2
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 400VFBGA

In Stock182

More on Order

Series: Automotive, AEC-Q100, SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
XC7Z015-L1CLG485I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 485CSBGA

In Stock228

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-LFBGA, CSPBGA
Supplier Device Package: 485-CSBGA (19x19)
M2S050TS-1FG896I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock146

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)