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SoC (System On Chip)

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CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)
Records 2,134
Page 21/72
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Part Number
Manufacturer
Description
In Stock
Quantity
Series
Architecture
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
M2S050TS-1VFG400I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 400VFBGA

In Stock331

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
M2S060T-1FG484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock353

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060T-1FGG484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock312

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-1FG484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock245

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-1FGG484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock140

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-FG484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock413

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-FGG484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock312

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S090T-1FCS325
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock170

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090T-1FCSG325
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock364

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090T-FCS325I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock355

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090T-FCSG325I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock249

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-FCS325
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock443

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-FCSG325
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock237

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
XA7Z020-1CLG400I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 400BGA

In Stock229

More on Order

Series: Automotive, AEC-Q100, Zynq®-7000 XA
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA, CSPBGA
Supplier Device Package: 400-CSPBGA (17x17)
XC7Z020-2CLG400E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 766MHZ 400BGA

In Stock195

More on Order

Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 766MHz
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 400-LFBGA, CSPBGA
Supplier Device Package: 400-CSPBGA (17x17)
M2S050-1FG896I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock182

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050-1FGG896I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock387

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050T-1FG896
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock360

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050T-1FGG896
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock171

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050T-FG896I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock342

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050T-FGG896I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock131

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050TS-FG896
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock408

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050TS-FGG896
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock103

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S090-1FCS325I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock136

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S090-1FCSG325I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 325BGA

In Stock362

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 325-TFBGA, CSPBGA
Supplier Device Package: 325-CSPBGA (11x11)
M2S050TS-1FG484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock499

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S050TS-1FGG484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock223

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-1VF400I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 400VFBGA

In Stock120

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
M2S060TS-1VFG400I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 400VFBGA

In Stock352

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
M2S060T-1FG676I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock111

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)