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SoC (System On Chip)

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CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)
Records 2,134
Page 25/72
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Part Number
Manufacturer
Description
In Stock
Quantity
Series
Architecture
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
M2S060T-1FG484M
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock204

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060T-1FGG484M
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock354

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S150-FC1152
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

In Stock263

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)
M2S150-FCG1152
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

In Stock400

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)
XCZU2EG-1SBVA484E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 484FCBGA

In Stock152

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-BFBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)
M2S090TS-1FG676I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock255

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S090TS-1FGG676I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 676FBGA

In Stock245

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
M2S150-FCS536
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

In Stock228

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 536-LFBGA, CSPBGA
Supplier Device Package: 536-CSPBGA (16x16)
M2S150-FCSG536
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

In Stock167

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 536-LFBGA, CSPBGA
Supplier Device Package: 536-CSPBGA (16x16)
M2S150T-FCV484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock442

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BFBGA
Supplier Device Package: 484-FBGA (19x19)
M2S150T-FCVG484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock283

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BFBGA
Supplier Device Package: 484-FBGA (19x19)
M2S050TS-1FG484M
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock250

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S050TS-1FGG484M
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock171

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
XCZU2EG-1SFVA625E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 625FCBGA

In Stock383

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 625-BFBGA, FCBGA
Supplier Device Package: 625-FCBGA (21x21)
M2S150-1FCV484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock280

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BFBGA
Supplier Device Package: 484-FBGA (19x19)
M2S150-1FCVG484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock143

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BFBGA
Supplier Device Package: 484-FBGA (19x19)
M2S150-FCV484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock328

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BFBGA
Supplier Device Package: 484-FBGA (19x19)
M2S060TS-1FG484M
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock394

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-1FGG484M
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock424

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
XCZU2EG-1SFVC784E
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock276

More on Order

Series: Zynq® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
M2S090TS-1FGG484T2
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock213

More on Order

Series: Automotive, AEC-Q100, SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)
XCZU2CG-1SFVA625I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 625FCBGA

In Stock191

More on Order

Series: Zynq® UltraScale+™ MPSoC CG
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 625-BFBGA, FCBGA
Supplier Device Package: 625-FCBGA (21x21)
XCZU2CG-1SFVC784I
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

In Stock316

More on Order

Series: Zynq® UltraScale+™ MPSoC CG
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
M2S150T-FCS536
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

In Stock227

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 536-LFBGA, CSPBGA
Supplier Device Package: 536-CSPBGA (16x16)
M2S150T-FCSG536
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

In Stock406

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 536-LFBGA, CSPBGA
Supplier Device Package: 536-CSPBGA (16x16)
M2S150T-1FCV484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock328

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BFBGA
Supplier Device Package: 484-FBGA (19x19)
M2S150T-1FCVG484
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock433

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BFBGA
Supplier Device Package: 484-FBGA (19x19)
M2S150T-FCV484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock176

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BFBGA
Supplier Device Package: 484-FBGA (19x19)
M2S150T-FCVG484I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

In Stock494

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BFBGA
Supplier Device Package: 484-FBGA (19x19)
M2S150T-FC1152
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

In Stock208

More on Order

Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)