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CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)

Records 2,134

Page 24/72

Part Number	Manufacturer	Description	In Stock	Series	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
XC7Z015-2CL485I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 766MHZ 484BGA	In Stock299 More on Order	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 766MHz	Primary Attributes: Artix™-7 FPGA, 74K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-LFBGA, CSPBGA	Supplier Device Package: 484-CSPBGA (19x19)
M2S090T-1FG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock424 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090T-1FGG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock137 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090T-FG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock490 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090T-FGG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock129 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090TS-FG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock163 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090TS-FGG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock238 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090T-1FG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock222 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S090T-1FGG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock455 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S090TS-1FG484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock406 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S090TS-1FGG484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock385 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S090TS-FG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock411 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S090TS-FGG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock474 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
XCZU2CG-1SBVA484E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA	In Stock109 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 484-BFBGA, FCBGA	Supplier Device Package: 484-FCBGA (19x19)
M2S090-1FG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock161 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090-1FGG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock216 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
XCZU2CG-1SFVA625E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock337 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
M2S150-FCV484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock177 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BFBGA	Supplier Device Package: 484-FBGA (19x19)
M2S150-FCVG484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock308 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BFBGA	Supplier Device Package: 484-FBGA (19x19)
XCZU2CG-1SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock191 More on Order	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
M2S090TS-1FG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock135 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S090TS-1FGG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock129 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S090T-1FGG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock321 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090T-1FG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock157 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090TS-1FG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock160 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090TS-1FGG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock118 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090TS-FG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock322 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090TS-FGG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock388 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S050T-1FG484M	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock255 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -55°C ~ 125°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S050T-1FGG484M	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock460 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -55°C ~ 125°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)

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