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Technology Articles

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Nexperia's outstanding SiC MOSFET discrete devices are available in the increasingly popular D2PAK-7 package

2024-05 Connectors Nexperia
[May 24 2024] Nexperia announced the availability of its industry-leading 1200 V silicon Carbide (SiC) MOSFETs in a D2PAK-7 Surface Mount Device (SMD) package available in 30, 40, 60 and 80 mΩ RDSon values. This follows Nexperia's announcement in late 2023 of two separate SiC MOSFET devices in 3-pin and 4-pin TO-247 packages. It will allow its SiC MOSFET portfolio to rapidly expand to include devices with RDSo ...
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The partners provide a total transceiver-to-antenna solution for next-generation 5G modems

2024-05 Power Skyworks Solutions
[May 23 2024] Skyworks solutions, Inc. and Samsung Electronics Co., Ltd. announced a strategic partnership to provide SKY5 transceiver to Antenna RFFE total solutions for the next generation 5G modem platform. This complete end-to-end solution is designed to seamlessly integrate 5G connectivity across multiple bands and modes, while optimizing performance, energy efficiency and design flexibility to support th ...
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Switching IEC inlet with EMI filter provides complete circuit protection

2024-05 Power Enocean
[May 23 2024] The MF 320 IEC imported EMC filter from EMIS enhances the EMI immunity of electronic devices while adding the safety isolation of bipolar switches and double fuses. To suppress unwanted incoming interference from the power line, the device also reduces any system noise reflected onto the main power supply. The filter meets the growing EMC requirements of industrial, medical and ITE equipment. App ...
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Power Integrations launches "New dual Channel" for 1.2kV to 2.3kV

2024-05 Power Power Integrations
[May 22 2024] Power Integrations, a well-known company in the field of gate driver technology for medium and high voltage inverter applications, announced the launch of the SCALE-iFlex™ XLT series of dual-channel plug and play gate drivers. Suitable for a single LV100 (Mitsubishi), XHPTM 2 (Infineon), HPnC (Fujifilm) and equivalent semiconductor power modules up to 2300V, the module is suitable for energy stor ...
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Allegro MicroSystems releases the Power Thru combination chip, further expanding the isolated gate drive product line

2024-05 Connectors Allegro MicroSystems, LLC
[May 22 2024] Allegro MicroSystems, a global leader in sensing technology and power semiconductor solutions for motion control and energy saving systems, announced the third product in its high-voltage Power-Thru product family. Allegro's two-chip AHV85000 and AHV85040 isolated gate driver IC solutions work in tandem with external transformers to provide greater design freedom and power efficiency for clean en ...
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Next generation high performance op amp for automotive and industrial applications

2024-05 Power Nuvoton Technology
[May 21 2024] NOVOSENSE Microelectronics has released its new NSOPA series of general-purpose op-amps. Engineered for automotive and industrial applications, these amplifiers can be employed for signal conditioning of voltage, current, temperature, and other signals, OBC/DC-DC/PDU, traction inverters, BMS, thermal management, BCM, industrial automation, photovoltaic inverters, motor drivers, digital power supp ...
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New IEC connectors and power input modules and PDUs are unveiled

2024-05 Power LEM
[May 21 2024] L-com introduces a new line of IEC connectors and power input modules, IEC connector accessories and IEC distribution units.Collectively, these products provide reliable, uninterrupted AC power connections for critical equipment. They power computers, monitors, printers, servers, networking equipment, audio and video equipment, industrial machinery, and more. Faulty power connections can become a ...
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Parker Hannifin introduces Service Master COMPACT, a measurement device for field monitoring and diagnostics

2024-05 Connectors Parker Chomerics
[May 20 2024] Parker Hannifin Corporation announced the launch of Service Master COMPACT, a powerful measuring device that provides real-time monitoring and diagnostic services for walking machinery and industrial hydraulic applications. Rugged IP65-rated housing and oil-resistant rubber cover for harsh conditions in construction machinery, agriculture, railway and defense industries. The Service Master COMPAC ...
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TDK introduces a new ultra-thin, lightweight Permalloy film that effectively shields low-frequency band noise

2024-05 Connectors TDK
[May 20 2024] TDK Corporation further expands its Flexield Permalloy film portfolio with the introduction of the new IPM01 series. The new product uses an ultra-thin (0.006 mm), lightweight design to achieve high permeability and loss. The new material can effectively block out low-frequency band noise, an increasingly common problem in electric vehicles. Mass production will begin in May 2024. In recent years ...
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Meisin Semiconductor launches new series of high-performance eOIS image stabilization drivers

2024-05 Connectors Mide Technology Corporation
[May 15 2024] New Semiconductor, a global leader in MEMS sensing technology solutions, announced the introduction of the MSD4100WA, a new product in the eOIS image stabilization driver family. The product integrates high precision and low noise silicon based linear Hall sensor, H bridge constant current drive circuit and high precision hardware PID algorithm OIS is the abbreviation of optical image stabilizati ...
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Generative AI opens a new cycle of change, and integration lays the foundation for the development of GenAI

2024-05 Power Amgis
[May 15 2024] Generative Artificial Intelligence (GenAI), as a cutting-edge artificial intelligence technology, has gradually become a focus in the field of science and technology in recent years. It integrates deep learning, natural language processing, image processing and other fields of technology, with strong generative ability and creativity, is seen as a key driving force to open a new cycle of change. ...
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Infineon and ETAS use ESCRYPT CycurHSM to improve the security of the next generation of AURIX™ microcontrollers

2024-05 Connectors Infineon Technologies
[May 14 2024] As the automotive industry transitions to software-defined vehicles and new E/E architectures, there is an increasing demand for high-performance hardware and robust cybersecurity solutions. To address this need, Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, has partnered with automotive software provider ETAS to integrate the ESCRYPT CycurHS ...