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Infineon partner Thistle Technologies combines Verified Boot with the Infineon OPTIGA™ Trust M
2024-04
Connectors
Infineon Technologies
[Apr 11 2024] Infineon Technologies AG has announced that its OPTIGA™ Trust M security controller is now integrated with Thistle Technologies' Verified Boot technology. Thistle Technologie is a pioneer in advanced security solutions for connected devices. This integration makes it easy for designers to defend their devices against firmware tampering and protect the integrity of the software supply chain. The r ...

Microchip introduces the AVR DU series of USB microcontrollers that support enhanced code protection and power output up to 15W
2024-04
Connectors
Microchip Technology
[Apr 11 2024] This family of products helps embedded designers easily implement USB capabilities in a wider range of systems. The advantages of Universal Serial Bus (USB) interfaces in embedded design include compatibility with various devices, simplified communication protocols, field update capabilities, and power supply capabilities. To help easily integrate this functionality into embedded systems, Microch ...

Teledyne e2v's unique 5D image sensor provides real-time 2D vision and 3D depth data
2024-04
Sensors
Teledyne LeCroy
[Apr 10 2024] Teledyne e2v, a company owned by Teledyne Technologies and a global innovator in imaging solutions, announced the launch of Topaz5D, a full HD CMOS image sensor designed to combine 2D vision with 3D depth map generation. A single Topaz5D sensor for use in challenging lighting conditions provides 3D object depth information based on the detected contrast, making it ideal for a variety of logistics ...

How can highly integrated embedded processors drive the development of industrial robots
2024-04
Power
Advanced Energy
[Apr 10 2024] With advances in semiconductor technology and the growing need for smarter, safer and more efficient systems, industrial robotics has undergone a significant transformation in recent years. At the heart of this transformation is the use of advanced embedded processors, which use a system-on-chip (SoC) architecture that integrates various components, including peripherals and hardware accelerators ...

TDK introduces compact gate drive transformers
2024-04
Connectors
TDK
[Apr 9 2024] TDK Corporation (Tokyo Stock Exchange: 6762) has expanded the EPCOS InsuGate Series (B78541A) SMT transformer portfolio with the introduction of two new components. The new element uses a manganese zinc (MnZn) ferrite core, which is compact in size and supports high operating voltages, operating frequencies from 100 kHz to 500 kHz, and operating temperatures from -40°C to +150°C. Ideal for IGBT a ...

Diodes' small, micropower Hall effect switches are compatible with low voltage chipsets
2024-04
Connectors
Diodes Incorporated
[Apr 9 2024] Diodes introduces three new Hall-effect switches, AH1899A/B/S, that operate at low supply voltage and very low static current to extend battery life in mobile and portable devices. The AH1899A/B/S can be used to detect whether the covers and cases of portable electronic devices such as smartphones and tablets are open. It can also be used for proximity detection in digital cameras, game consoles ...

Microchip introduces CEC1736 real-time platform trust root device
2024-04
Power
Microchip Technology
[Apr 8 2024] Microchip Technology makes embedded security solutions more accessible to customers through its CEC1736 TrustFLEX device. The CEC1736 Trust Shield family is a single-chip based platform trust root solution that provides network resilience for data center, telecommunications, networking, embedded computing and industrial applications. As part of the TrustFLEX platform, these devices are partially ...

Qualcomm has introduced two next-generation audio platforms to enhance the wireless audio experience for high-end and mid-tier earbuds, headphones and speakers
2024-04
Connectors
Qualcomm
[Apr 7 2024] Qualcomm Technologies International, Inc. announced the launch of two new advanced audio platforms: the third-generation Qualcomm S3 audio platform and the third-generation Qualcomm S5 audio platform. As the most powerful platforms in their respective families, they will deliver an unprecedented audio experience at the S5 and S3 levels. The third-generation Qualcomm S3 audio platform is designed ...

MDmesh DM9 overjunction MOSFET improves silicon chip energy efficiency
2024-04
Connectors
STMicroelectronics
[Apr 1 2024] These silicon-based transistors have excellent on-resistance RDS(on) per chip area and very low gate charge, combined with very low energy loss and excellent switching performance, and the quality factor has become a new market benchmark. St's latest MDmesh DM9 technology ensures a narrower distribution of gate source threshold voltages (VGS(th)), resulting in sharper switching waveforms and lowe ...

Renesas was the first in the industry to introduce a general-purpose 32-bit RISC-V MCU with a self-developed CPU core
2024-04
Connectors
Renesas Electronics America
[Apr 1 2024] Renesas Electronics announced the industry's first general purpose 32-bit RISC-V microcontroller (MCU), the R9A02G021, built on an in-house self-developed CPU core. While several MCU vendors have recently joined investment alliances to advance RISC-V product development, Renesas has independently designed and tested a new RISC-V kernel that is now in commercial products and available for sale wor ...

OmniVision announces brushless DC motor drive solutions for vehicles
2024-03
Power
OmniVision Technologies Inc
[Mar 29 2024] OmniVision introduces a new brushless DC motor driver chip WXMD1705. The chip has features such as ultra-low static power consumption, wide input voltage range, drive and power stages can be powered independently, and supports a rich diagnosis and protection mechanism, providing a richer design choice for motor control of the body. With the increasing demand for comfort and safety of modern vehic ...

Microchip publishes reference designs that comply with the Qi v2.0 standard and are based on dsPIC33
2024-03
Power
Microchip Technology
[Mar 29 2024] With major charger manufacturers, including the automotive industry, committed to implementing the Qi v2.0 (Qi2) standard, Microchip Technology Inc. has released a Qi 2.0 dual-board wireless power transmitter reference design. The Qi2 reference design uses a single dsPIC33 digital signal controller (DSC) to provide efficient control to optimize performance. The Wireless Charging Alliance (WPC) re ...