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Technology Articles

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Infineon Launches a New Generation of High Performance XENSIV MEMS Microphone

2022-09 Semiconductors Infineon Technologies
[Sep 2 2022] Infineon Technology Co., Ltd. released a new generation of XENSIV MEMS microphone. New products include IM69D127, IM73A135 and IM72D128, which further expand Infineon's microphone product portfolio and set a new benchmark for the industry. These MEMS microphones with optional power modes are applicable to various consumer electronic products, such as headphones with active noise reduction (ANC) f ...
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Vishay introduces a new AEC-Q200 standard thin DC Link film capacitor with high reliability and performance

2022-09 Semiconductors Vishay
[Sep 2 2022] Vishay Intertechnology, Inc. announced the launch of a new series of thin DC Link metallized polypropylene film capacitors that meet AEC-Q200 standards - MKP1848Se DC Link. Vishay Roederstein MKP1848Se DC Link is an advanced device in the industry. Under the conditions of rated voltage, temperature of 60 ° C/relative humidity of 93%, it has undergone temperature humidity bias (THB) test for 56 da ...
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NXP Launches New MCX Microcontroller Product Portfolio

2022-09 Semiconductors NXP
[Sep 2 2022] NXP Semiconductors officially released a new MCX microcontroller product portfolio, aiming to promote innovation in smart homes, smart factories, smart cities, and many emerging industries and edge applications of the Internet of Things. The product portfolio consists of four series, which are built on a common platform and supported by widely used MCUXpresso development tools and software suites ...
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Bourns Introduces High Current Shielded Power Inductors

2022-09 Semiconductors Bourns
[Sep 2 2022] Bourns introduced a new high current shielded power inductor. The five new power inductors are SRP2010TMA, SRP2012TMA, SRP2510TMA, SRP2512TMA and SRP3212A, which are miniature, 0.8 x1 mm small size designs, and all comply with AEC-Q200 standards. The five series adopt Bourns' advanced metal powder magnetic core and manufacturing process design, as well as the advantages of magnetic shielding stru ...
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EC12 power input module expands product range

2022-09 Power Schurter
[Sep 2 2022] The compact EC12 series power input module with snap in installation has the same integrated functions as the flange installation model: IEC C20 power input socket, high-performance single-stage filter and power switch (with or without indicator light). In addition, the series is equipped with a snap in arm to ensure a tight fit when installing the panel. The metal edges on the housing ensure goo ...
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ST semiconductor high bandwidth common mode filter ensures gigabit serial port signal integrity

2022-09 Semiconductors STMicroelectronics
[Sep 1 2022] The new common mode filter introduced by STC has a differential bandwidth up to 10.7GHz, which can prevent the new generation serial digital interface from affecting the antenna reception sensitivity of adjacent wireless circuits. The dual channel ECMF2-40A100N10 and the four channel ECMF4-40A100N10 are compatible with high-speed interface standards, including USB 3.2 Gen 2, USB4, HDMI 2.1 and Di ...
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ST Semiconductor Launches Low Noise Low Voltage Regulator for Energy Saving

2022-09 Semiconductors STMicroelectronics
[Sep 1 2022] The LD56020 200mA low-voltage drop regulator of ST Semiconductor uses 1.1V to 5.5V power supply, with low output noise, and is suitable for applications with high requirements for stability and battery life. The LD56020 has a very competitive price and is very suitable for mobile devices, visual sensors and wireless connection modules. The voltage drop is very low. The maximum value is only 190mV ...
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Toshiba launched five new MOSFET grid drive ICs to help miniaturize mobile electronic equipment

2022-09 Semiconductors Toshiba Semiconductor and Storage
[Sep 1 2022] Toshiba Electronic Components and Storage Devices Co., Ltd. announced that five new products applicable to mobile electronic devices such as wearable devices have been added to its TCK42xG series MOSFET gate drive IC products. The new products of this series are equipped with overvoltage locking function, which can control the gate voltage of external MOSFETs according to the input voltage. The n ...
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Renesas Electronics released RZ/T2M motor control MPU to realize fast and high-precision control of servo motor

2022-09 Semiconductors Renesas Electronics America Inc.
[Sep 1 2022] Renesas Electronics, a global semiconductor solution supplier, announced the launch of Rexa's high-performance RZ/T2M motor control microprocessor unit (MPU), which is used in AC servo drives, industrial robots and other fields. RZ/T2M combines fast, high-precision real-time motor control capability and support for the latest industrial Ethernet protocol on a single chip, while realizing function ...
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Infineon launched a highly integrated and flexible WLC wireless charging platform

2022-09 Semiconductors Infineon Technologies
[Sep 1 2022] In the past few years, with the rapid development of the wireless charging market, more and more applications and wireless charging functions have made it advantageous for their own use. In order to help designers overcome the challenges posed by modern wireless charging and meet the requirements of key applications, Infineon Technology Co., Ltd. released the WLC1115 transmitter controller IC, th ...
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Microchip introduces devices and ecosystems that conform to ISO 26262 and are ready for AUTOSAR, simplifying automobile design

2022-09 Semiconductors Microchip Technology
[Sep 1 2022] With the development of the electric vehicle and autonomous vehicle market, original equipment manufacturers (OEMs) are faced with increasing application complexity and the demand for functional safety and reliable solutions that comply with AUTOSAR and ISO 26262. In order to support automotive developers to design scalable applications for the future technology and meet the requirements of the l ...
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Renesa Electronics is the first to launch the next generation server

2022-08 Semiconductors Renesas Electronics America
[Aug 31 2022] Renesa Electronics, the global semiconductor solution provider, announced that it was the first to launch the RG3MxxB12 series of I3C intelligent switching devices for the next generation server motherboards and other infrastructure equipment - the new chips greatly improved scalability and reliability, while reducing the complexity of high-performance system design, Enable the I3C control plane ...