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Technology Articles

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STMicroelectronics Advanced MEMS sensors help you start the Onlife era

2022-08 Semiconductors STMicroelectronics
[Aug 21 2022] STMicroelectronics introduces its third generation MEMS sensor. The new generation of sensors helps consumer mobile products, smart industry, smart medical and smart retail products achieve new leaps in performance and functionality. MEMS technology implementation is the foundation of robust and reliable chip-level motion and environmental sensors, and today's smartphones and wearable devices rel ...
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TT Electronics is a current sensing resistor series product with AEC-Q200 certification

2022-08 Power TT Electronics
[Aug 21 2022] TT Electronics announced the introduction of LRMAP4026 series low resistance metal alloy power resistors, designed for power supply, motor drive and battery monitoring. This series of resistors can provide four terminal Kelvin precision and high current capacity for all industrial applications, including automobiles. Because the four terminal Kelvin connection improves the accuracy, it will only ...
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Wurth Electronics launches optocoupler products

2022-08 Semiconductors Wurth Electronics
[Aug 21 2022] Wurth Electronics has expanded its optoelectronics product line by adding optocoupler products with all common packages and CTR (current transfer ratio) values. It includes WL-OCPT phototriode types in DIP-4, SOP-4 and LSOP-4 packages, and WL-OCDA Darlington structures in DIP-4 and SOP-4 packages. Different packages also contain a range of lead frame varieties. The CTR value of an element ranges ...
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Bourns launched two car gauge high current shielded power inductor mechanical strength greatly improved

2022-08 Power Bourns
[Aug 21 2022] Bourns has introduced two new types of large current shielded power inductors, which can enhance the mechanical strength even in harsh vibration applications. Bourns SRP1038WA and SRP1265WA shielded power inductor series are designed with wider side terminal lead frame, which can withstand 15 G standard or 30 G peak vibration, so they exceed 5 G three to six times of AEC-Q200 standard requirement ...
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Infineon Launches New Generation MOTIX Half Axle Drive IC

2022-08 Semiconductors Infineon Technologies
[Aug 21 2022] Following the successful release of BTN89xx, Infineon Technology Co., Ltd. launched the new MOTIX BTN99xx (NovalithIC ™+) Series intelligent half bridge drive integrated chip. The chip integrates P channel high side MOSFET and N channel low side MOSFET in a single package, as well as multiple intelligent driving ICs. BTN99xx will become an ideal choice for automotive applications with its ease of ...
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Toshiba has launched ultra-low capacitance TVS diodes that can protect high-frequency antennas of Internet of Things devices from ESD

2022-08 Semiconductors Toshiba Semiconductor and Storage
[Aug 20 2022] Toshiba Electronics Components and Memory Devices has announced the launch of an ultra-low capacitance TVS diode, DF2B6M4BSL, for high-frequency antennas. The diode can protect semiconductors and other electronic components from static electricity and noise, and inhibit signal deterioration. High-frequency antennas used in radio communications such as Wi-Fi need to protect their internal electron ...
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NXP unveils S32G Automotive Integration platform to accelerate software-defined vehicle development

2022-08 Semiconductors NXP
[Aug 20 2022] The newly released S32G GoldVIP from NXP Semiconductors N.V. helps software-defined vehicles with S32G automotive network processors address real-time and application development challenges. This pioneering automotive integration platform offers multiple value propositions for S32G processor evaluation, software development, and rapid prototyping efforts. With real-time use case and resource moni ...
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Ams new AS7343 multichannel spectral sensor adds XYZ technology

2022-08 Semiconductors ams
[Aug 20 2022] Ams further expands its spectral sensor portfolio with the launch of the new AS7343 multichannel spectral sensor. The sensor is the company's first product to combine multichannel color analysis with XYZ sensor technology to measure color and light intensity as seen by the human eye. Colorimeters, portable spectrometers, and consumer devices integrated with the AS7343 sensor will be "more powerfu ...
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Ampleon has released the performance enhancing 3rd generation silicon carbide based gallium nitride transistor

2022-08 Power Ampleon
[Aug 20 2022] Ampleon Semiconductor (Ampleon) has announced the launch of two new broadband silicon carbide based gallium nitride (GaN-on-SiC) high electron mobility transistors (HEMTs) with 30W CLF3H0060(S)-30 and 100W CLF3H0035(S)-100 power levels. These two high linearity devices are the first products of our recently certified 3rd generation GaN-SiC HEMT process. These devices provide wideband high lineari ...
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SEMPER NOR Flash Flash Solutions Center simplifies design and reduces time-to-market for safety-critical applications

2022-08 Semiconductors Infineon Technologies
[Aug 20 2022] Infineon Technologies Inc. has announced the SEMPER Solution Center, a new development tool for the award-winning SEMPER NOR Flash family of products. As a one-stop site that integrates all application modules, SEMPER Solutions Center covers all the components needed to integrate SEMPER NOR Flash into applications, enabling developers to quickly design safety-critical automotive, industrial, and ...
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Littelfuse Introduces New 828 Series High Voltage Tubular Fuses

2022-08 Sensors Littelfuse
[Aug 20 2022] Littelfuse Corporation announces the launch of the new 828 Series High Voltage Tubular Fuses, which have been specifically designed and tested to meet the circuit protection needs of compact automotive electronics, especially electric vehicle (EV) applications. These reliable fuses are qualified to Littelfuse internal AEC-Q200 with a high breaking rating (10 KA @ 1,000 Vdc) and are ideal for on-b ...
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Microchip emulates embedded SuperFlash technology

2022-08 Semiconductors Microchip Technology
[Aug 20 2022] Computing in memory technology is expected to eliminate a large number of data communication bottlenecks caused by artificial intelligence (AI) voice processing at the edge of the network, but it requires an embedded memory solution that can simultaneously perform neural network computing and storage weights. Microchip Technology Inc announced through its subsidiary TPV Semiconductor (SST) that i ...