Technology Articles

2022-09 Power Diodes Incorporated

[Sep 4 2022] Diodes introduced two new multiplexed/demultiplexed linear ReDrivers that support the 20Gbps DisplayPort Ultra High Bit Rate (UHBR20) transmission mode. These two ReDriver devices are the first in the industry to meet the high-speed data transmission requirements of DisplayPort. The typical input to output delay of PI3DPX20021 and PI3DPX20012 is only 0.5ns. These two devices are not limited by th ...

2022-09 Semiconductors NXP

[Sep 3 2022] NXP Semiconductor added 4-channel dual polarized analog beam formers MMW9012K and MMW9014K, as well as an antenna system development kit, to the 5G product series. These two analog beam formers use NXP's SiGe technology to support dual polarization, which can improve the reliability of 5G millimeter wave solutions, improve integration, reduce the size of 5G base stations, reduce costs, and reduce ...

2022-09 Power Melexis Technologies NV

[Sep 3 2022] Melexis announced the introduction of MLX9042x series, adding new members to its 3D magnetic position sensing solution. This series of sensor chips are designed for cost conscious automotive customers, and can accurately and safely measure absolute position in harsh and noisy environments and a wider temperature range The solution is mainly applied to automobile customers, including power system ...

2022-09 Semiconductors Rohm Semiconductor

[Sep 3 2022] Rohm & Schwartz announces the launch of a new high-performance R&S ADD597 all-in-one antenna system for direction finding and monitoring. The system is a key component of fixed, mobile and portable spectrum monitoring stations. The R&S ADD597 combines the use of a single-channel direction finder to provide reliable measurements even in dense spectrum environments. The system provides high accurac ...

2022-09 Semiconductors Infineon Technologies

[Sep 3 2022] Infineon Technologies Co., Ltd. will launch AIROC CYW20820 Bluetooth and low-power Bluetooth System on Chip (SoC), further expanding its product portfolio of AIROC Bluetooth series. AIROC CYW20820 Bluetooth and low-power Bluetooth system on chip are specially designed for Internet of Things applications and comply with Bluetooth 5.2 core specifications. It can support rich application scenarios o ...

2022-09 Semiconductors Teledyne LeCroy

[Sep 3 2022] Teledyne e2v announced that it will launch EV12AQ600/5 option with integrated license key, which can directly use the new ADX4 post-processing algorithm developed by SP Devices of Teledyne Group. The ADX4 spurious suppression IP can dynamically suppress spurious frequency components caused by gain, offset and phase mismatches between the four ADC cores. Time interleaving is a reliable architectur ...

2022-09 Semiconductors Microchip Technology

[Sep 3 2022] Motor control system developers are rapidly adopting inductive alternatives to replace Hall effect position sensors and old-fashioned magnetic resolver solutions, because these inductive alternatives do not require expensive magnets and other transformer based heavy-duty structures, and can be integrated into simple and compact printed circuit boards (PCBs). Microchip Technology Inc announced the ...

2022-09 Semiconductors Vishay

[Sep 2 2022] Vishay Intertechnology, Inc. announced the launch of a new series of thin DC Link metallized polypropylene film capacitors that meet AEC-Q200 standards - MKP1848Se DC Link. Vishay Roederstein MKP1848Se DC Link is an advanced device in the industry. Under the conditions of rated voltage, temperature of 60 ° C/relative humidity of 93%, it has undergone temperature humidity bias (THB) test for 56 da ...

2022-09 Semiconductors NXP

[Sep 2 2022] NXP Semiconductors officially released a new MCX microcontroller product portfolio, aiming to promote innovation in smart homes, smart factories, smart cities, and many emerging industries and edge applications of the Internet of Things. The product portfolio consists of four series, which are built on a common platform and supported by widely used MCUXpresso development tools and software suites ...

2022-09 Semiconductors Bourns

[Sep 2 2022] Bourns introduced a new high current shielded power inductor. The five new power inductors are SRP2010TMA, SRP2012TMA, SRP2510TMA, SRP2512TMA and SRP3212A, which are miniature, 0.8 x1 mm small size designs, and all comply with AEC-Q200 standards. The five series adopt Bourns' advanced metal powder magnetic core and manufacturing process design, as well as the advantages of magnetic shielding stru ...

2022-09 Power Schurter

[Sep 2 2022] The compact EC12 series power input module with snap in installation has the same integrated functions as the flange installation model: IEC C20 power input socket, high-performance single-stage filter and power switch (with or without indicator light). In addition, the series is equipped with a snap in arm to ensure a tight fit when installing the panel. The metal edges on the housing ensure goo ...

2022-09 Semiconductors Infineon Technologies

[Sep 2 2022] Infineon Technology Co., Ltd. released a new generation of XENSIV MEMS microphone. New products include IM69D127, IM73A135 and IM72D128, which further expand Infineon's microphone product portfolio and set a new benchmark for the industry. These MEMS microphones with optional power modes are applicable to various consumer electronic products, such as headphones with active noise reduction (ANC) f ...