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Technology Articles

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NXP and ZF collaborate to develop SIC-based traction inverters to help enhance electric vehicle powertrains

2024-06 Power NXP
[Jun 17 2024] NXP Semiconductors has announced a partnership with ZF Friedrichshafen AG, a leader in electric vehicles, for the next generation of SiC based traction inverter solutions for electric vehicles (EV). The solution uses NXP's advanced GD316x High voltage (HV) isolated gate drivers designed to accelerate the adoption of 800V and SiC power devices. The GD316x product family enables safe, efficient and ...
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Nexperia's 650 V SiC diode portfolio is now available for automotive and broader industrial applications

2024-06 Passive Components Nexperia
[Jun 17 2024] Nexperia announced that its best-in-class 650 V, 10 A silicon carbide (SiC) Schottky diode is now automotive compliant (PSC1065H-Q) and in a true two-pin (R2P) DPAK (TO-252-2) package for a variety of applications in electric vehicles and other vehicles. In addition, TO further expand its SiC diode portfolio, Nexperia now offers industrial-grade devices rated at 6 A, 16 A and 20 A in TO-220-2, TO ...
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Intel's core Power can launch the OLEA U310 automotive SoC, a single can replace six standard MCUS

2024-06 Power Intel
[Jun 17 2024] Intel's Core Power Corporation has introduced a new system-on-a-chip (SoC) for vehicles called the OLEA U310. The main reason for this chip is its powerful performance and integration, one OLEA U310 can replace six standard microcontrol units (MCUS), significantly simplifying the design and manufacturing of automotive electronic systems. The emergence of the OLEA U310 can be said to be a revoluti ...
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Excelitas Technologies introduces the PX.DIMAX 3.6ST streaming high-speed camera for scientific and industrial applications

2024-06 Connectors Excelitas Technologies
[Jun 14 2024] Excelitas TechnologiesCorp recently launched its PX.DIMAX 3.6ST streaming high-speed camera for scientific and industrial applications. The new camera uses real-time image streaming to capture sharp images at a resolution of 3.6 megapixels and a recording speed of 2,166 frames per second, making it ideal for high-speed sorting, analysis and inspection applications including production control and ...
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Microchip introduces a new solution to make electric vehicle charger design easier

2024-06 Semiconductors Microchip Technology
[Jun 14 2024] The drive to decarbonize requires sustainable emission reduction solutions, and the market for battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs) continues to grow in tandem. On-board chargers are one of the key applications for electric vehicles, converting alternating current to direct current to charge high-voltage batteries in cars. Microchip Technology announced th ...
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BridgeSwitch-2 BLDC IC products enhance the performance level of motor drive applications

2024-06 Power Power Integrations
[Jun 13 2024] Power Integrations has introduced a new High voltage integrated half bridge (IHB) motor driver IC product line, BridgeSwitch™ 2, to further enhance brushless direct current motor (BLDC) hardware and software combination solutions for applications up to 1 HP (746W). With integrated upper and lower tube drives and two enhanced FREDFETs, the new IC uses lossless current detection internally to deliv ...
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Diodes introduces 13.5Gbps high-speed video switch

2024-06 Power Diodes Incorporated
[Jun 13 2024] Diodes Corporation introduces 13.5Gbps high speed video switch PI3WVR41310. For the next generation of commercial displays, gaming displays, docking stations, video matrix switches and embedded product applications, the product improves resolution and refresh rate. The PI3WVR41310 four-channel video switch can be used as a 3:1 multiplexer or 1:3 demultiplexer. With an insertion loss of -1.8dB at ...
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Onsemi introduces new silicon carbide chips to help save energy in AI data centers

2024-06 Semiconductors ON Semiconductor
[Jun 13 2024] Onsemi has launched a new silicon carbide (SiC) chip designed to help artificial intelligence (AI) data centers achieve more efficient energy use. With the rapid development of AI technology, the energy consumption of data centers has become increasingly prominent, and how to reduce energy consumption while ensuring computing power has become an important issue in the industry. This innovative te ...
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Onsemi introduces complete power solutions to improve data center energy efficiency

2024-06 Power ON Semiconductor
[Jun 12 2024] As data centers become increasingly power-hungry to meet the massive processing demands of AI computing, improving energy efficiency is critical. The powerful combination of ON's latest generation T10 PowerTrench series and EliteSiC 650V MOSFETs provides a complete solution for data center applications that offers unmatched energy efficiency and superior thermal performance in a smaller package s ...
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Power Integrations introduces IC products that enhance the performance level of motor drive applications

2024-06 Power Power Integrations
[Jun 12 2024] Power Integrations further enhances brushless direct current motor (BLDC) solutions with the introduction of a new high-voltage integrated half-bridge (IHB) motor driver IC product line, the BridgeSwitch™ 2, for applications up to 1 HP (746W). With integrated upper and lower tube drives and two enhanced FREDFETs, the new IC uses lossless current detection internally to deliver up to 99% inverter ...
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Infineon introduces a high-performance NFC I2C bridging label product

2024-06 Connectors Infineon Technologies
[Jun 12 2024] The number of iot devices is rapidly increasing and being applied to a wide range of industries. As the number of smart devices increases, so does the user's demand for ease of device configuration and pairing. To this end, Infineon Technologies AG introduces the OPTIGA™ Authenticate NBT product. This is a high-performance NFC I2C bridging tag product for the implementation of functions such as s ...
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Qualcomm will use Nuvia self-developed core to return to the server chip market

2024-06 Power Qualcomm
[Jun 11 2024] Recently, Qualcomm announced that it will use Nuvia self-developed core to re-enter the server chip market. This news has caused widespread concern in the industry. As the world's leading semiconductor and telecommunications equipment company, Qualcomm has long occupied an important position in the field of mobile communication chips, but its performance in the server chip market has been relativ ...